Next Article in Journal
Preparation, Characterization and Photocatalytic Activity of La-Doped Zinc Oxide Nanoparticles
Previous Article in Journal
Ordered ZnO/Ni Hollow Microsphere Arrays as Anode Materials for Lithium Ion Batteries
Article Menu
Issue 7 (April-1) cover image

Export Article

Open AccessArticle
Materials 2019, 12(7), 1194; https://doi.org/10.3390/ma12071194

Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys

1
School of Resources, Environment and Materials, Guangxi University, Nanning 530004, China
2
Guangxi Key Laboratory of Processing for Non-Ferrous Metals and Featured Materials, Nanning 530004, China
3
School of Materials Science and Engineering, South China University of Technology, Guangzhou 510641, China
4
Shenzhen Exit Inspection and Quarantine Bureau Industrial Products Inspection Technology Center, Shenzhen 518067, China
*
Author to whom correspondence should be addressed.
Received: 15 March 2019 / Revised: 3 April 2019 / Accepted: 7 April 2019 / Published: 11 April 2019
  |  
PDF [47115 KB, uploaded 12 April 2019]
  |  

Abstract

This study investigates the effect of aluminum (Al) on the microstructure, micro-hardness, and wettability of environmentally friendly Sn-20Bi-xAl (x = 0, 0.1, 0.3, 0.5 (wt.%)) solder alloys. Scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS) analysis, and X-ray diffraction (XRD), were used to identify the microstructure morphology and composition. The spreading area and contact angle of the Sn-20Bi-xAl alloys on Cu substrates were used to measure the wettability of solder alloys. The results indicate that Al increased the hardness to a maximum value of ~27.1 HV for x = 0.5. When the content of Al was more than 0.3 wt.%, the hardness change value gradually flattened. From the spreading test results, Al reduced the wettability of solder alloys. When the content of Al was 0.1 wt.%, the change was slight. When more than 0.3 wt.%, the wettability of Sn-20Bi-xAl solder alloys sharply dropped. The corrosion resistance of Sn-20Bi-0.1Al alloy was the best, and the corrosion rate was at the lowest value at 0.092 mm/a due to the dense corrosion products. View Full-Text
Keywords: non-eutectic; Sn-20Bi alloy; wettability; aluminum; lead-free non-eutectic; Sn-20Bi alloy; wettability; aluminum; lead-free
Figures

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
SciFeed

Share & Cite This Article

MDPI and ACS Style

Yang, W.; Li, J.; Li, Y.; Feng, J.; Wu, J.; Zhou, X.; Yu, A.; Wang, J.; Liang, S.; Wei, M.; Zhan, Y. Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys. Materials 2019, 12, 1194.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Materials EISSN 1996-1944 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top