Yang, W.; Li, J.; Li, Y.; Feng, J.; Wu, J.; Zhou, X.; Yu, A.; Wang, J.; Liang, S.; Wei, M.;
et al. Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys. Materials 2019, 12, 1194.
https://doi.org/10.3390/ma12071194
AMA Style
Yang W, Li J, Li Y, Feng J, Wu J, Zhou X, Yu A, Wang J, Liang S, Wei M,
et al. Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys. Materials. 2019; 12(7):1194.
https://doi.org/10.3390/ma12071194
Chicago/Turabian Style
Yang, Wenchao, Jidong Li, Yitai Li, Junli Feng, Jingwu Wu, Xiankun Zhou, Aihua Yu, Jiahui Wang, Siyu Liang, Mei Wei,
and et al. 2019. "Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys" Materials 12, no. 7: 1194.
https://doi.org/10.3390/ma12071194
APA Style
Yang, W., Li, J., Li, Y., Feng, J., Wu, J., Zhou, X., Yu, A., Wang, J., Liang, S., Wei, M., & Zhan, Y.
(2019). Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys. Materials, 12(7), 1194.
https://doi.org/10.3390/ma12071194