Molten Salt Electrodeposition: Review
Abstract
:1. Introduction
2. Molten Salt Overview
- Wide thermal stability range and often low vapor pressure allows for high-temperature chemistry with rapid reaction rates.
- High dissolution capacity for a broad range of inorganic compounds such as oxides, carbides, nitrides, and other salts ensure that molten salts make perfect solvents for electrometallurgy, metal coating, by-product treatment, and energy conversion.
- Large potential window between decomposition limits enables the electrowinning of extremely electropositive elements or the synthesis of very electronegative elements [33].
2.1. Properties of Molten Salts
2.2. Molten Salt Applications
3. Molten Salt Electrodeposition
3.1. Electrochemical Cells
3.1.1. Electrodes
3.1.2. Electrolyte
3.1.3. Resulting Electrolytes–After Heat is Applied
- Loss of Materials through Volatilization: the fluoride solvents are much less vulnerable to loss by volatilization (i.e., the unwanted formation of fluoride electrolytes) because fluoride ions will strongly complex the refractory-metal ions of the highest oxidation numbers and, consequently, fluoride ions in the bulk melts are likely to displace chloride ions from the coordination shells of high-oxidation-number refractory-metal ions. For example, it is possible to measure the potential of a Ta electrode as a function of the number of moles of F− ions added; however, interpreting the complex-ion formation is problematic because the Ta(IV) chloride disproportionately reacts into Ta(V) fluoride, causing the Ta(V) to exhibit dynamic equilibria amongst the following species of chlorides and fluorides [48]. The partial pressure in solutions of refractory-metal chlorides suggests that the effects of both the solvent’s anions and its cationic characteristics can be very significant and, at times, even critical. For tantalum chlorides, binary-phase data offer some insights into the relative stability of tantalum chlorides in molten alkali chlorides [49]. These findings suggest that in the case of lithium chloride, the reaction tends to favor the right, leading to unstable solutions where covalency is predominant. In the case of stable Ta(V) solutions in CsCl, the ligand field effect plays a significant role. However, the presence of the Cs+ cation complicates matters by increasing the likelihood of lower oxidation states.
- Disproportionation Reactions: all the refractory metals may exist in a variety of oxidation states. For example, Ta exhibits oxidation states ranging from +5 to −1 [50]. It is also known that tantalum chlorides in the pure state can undergo disproportionation reactions at relatively low temperatures. The influence of solvation on these processes when the pure halide is dissolved in a molten alkali halide is not well established. Two types of disproportionation equilibria are possible in chlorides, for example, using Ta as our example, namely, a homogeneous equilibrium or a heterogeneous equilibrium [50].
- Formation of Clusters: cluster-compound formation or polymerization is a characteristic of the lower states of oxidation of the denser refractory metals [49]. Metal-atom cluster compounds have been manufactured employing molten alkali metal chloride melts [51]; for instance, the Ta cluster complex Ta6Cl184− is generated through a comproportionation reaction in which M = Li, Na, K, Rb, Cs. Temperatures range from 773 K to 1073 K based on M, with the reaction taking place in a closed system to prevent TaCl5 loss. It was obvious that the suitable choice of M+ will influence the preparation’s success [51]. M2RCl6, M3R2Cl9, MR4Cl11 and M4R5Cl18 are all potential polymerized cluster compounds in the molten solution. When R is Nb, a feasible candidate for M is Na+ or K+ [51]. The chemical production of such ions that are complex is likely to be hampered kinetically, while being favored thermodynamically. Because TaCl5 is readily formed on Ta anodes at high potential, it appears that the electrochemical production of clusters is similarly hampered. This could have significant implications for electrodeposition. Because the reaction is inhibited, the synthesis of Ta from TaCl5(g) can be carried out, and progresses at a relatively high current efficiency of 0.85–0.88 [52]. However, Nb production is only possible with a low current efficiency of 0.30, possibly due to the preferred cluster formation processes in the abundance of NaCl in the melt.
- Development of Compound-Based Oxide: oxyhalides, insoluble oxides, and stable oxycations can develop at high temperatures in a molten solution [53]. These oxides are exceedingly tough compounds of refractory materials, and it is critical that they are completely dissolved before electrolysis occurs. Impure materials like alkali-and alkaline-earth metal oxides, on the other hand, might have more subtle impacts. These impurities, for example, can react with lower-valency ions formed during electrodeposition in all-chloride or all-fluoride melts, leading to the production of insoluble coatings on the electrode surfaces. These unanticipated films, which can be oxypolynuclear anions or insoluble oxides, can have negative implications [49]. Metal oxide deposition from stable oxycations may be intrinsic in molten salt electrolysis.
3.2. Strategies for Tuning Electrodeposition
3.2.1. Cell Geometry
3.2.2. Electrode Kinetics
3.2.3. Thermodynamics of Cell Reactions
3.3. Advantages and Disadvantages of Molten Salt Synthesis Processes
3.3.1. Molten Salt Synthesis (MSS)
3.3.2. MSS Challenges and Solutions
- Crystal Quality: one of the potential concerns with the MSS is that the molten salts occasionally interact with the reaction vessels. For example, because of their high oxo-basicity, salts like alkali metal hydroxides and PbO are frequently utilized in MSS but tend to corrode Al and Pt reaction containers [64]. The resulting erosion of the surfaces of the Al and Pt reaction vessels could pollute the final material with traces of these elements. Similarly, traces of the molten salt materials may also be included into the final material. For example, flux/salt ions may result in flux inclusions within the material’s crystals (resulting in lower crystal quality) or alter the final crystal structure (resulting in crystals with undesirable performance). To circumvent these problems, the analogue of the common ion effect was investigated by utilizing salts with common ions present in the final desired output.
- Material Costs: most of the salts (e.g., such as KCl and NaCl) commonly used in MSS processes are plentiful and affordable, but the enormous volume of utilized salts is driving up the cost of large-scale nanomaterial manufacturing. Some of the alkali metals (e.g., Li) used in salt compounds are also individually expensive; however, a clever workaround has recently been demonstrated. Because alkali metals are water-soluble, when the metal salts are water-washed off of the material’s surface, they can be recycled. The development of optimized salt-recycling techniques has become increasingly critical for industrialization.
- Safety Hazards: some of the salts commonly used for MSS (e.g., metal fluorides) are human-toxic, and direct exposure may cause skin/eye irritation and damage to human tissue. As a result, caution should be exercised when using fluoride-based molten salts. Some salts, such as AlCl3, are either acidic or alkaline by nature and can induce corrosion. Heavy metal salts, including BaCl2 or BaF2, are known to be toxic to humans. They must be handled with caution and under all safeguards. Unless the reactions are carried out in closed systems, it is best to avoid employing salts with significant vapor pressures that consist of BaCl2, CsI, and ZnCl2. Furthermore, harmful NOx and SOx gases would be created if the salt mixture were heated close to the melting point of the salt. If breathed, they are exceedingly dangerous. As a result, it is preferable to perform the MSS in well-ventilated fume hoods. Personnel executing the reactions should additionally employ masks, goggles, gloves, and other safety equipment to protect themselves from corrosive and hazardous gases.
3.3.3. Molten Salt Electrodeposition
3.3.4. Molten Salt Electrodeposition Challenges and Solutions
- One disadvantage of using molten salts as solvents in electrolytic operations is that the metal deposits produced during electrolysis can be dendritic and/or powdery. The special precautions of the significant leaching process to separate the metal from the melt or avoid the secondary depositions from the melt can be taken.
- Recovering the deposit from the solidified solvent is a process similar to the beneficiation of crude ores, and requires energy-intensive and wasteful leaching, grinding, and flotation operations, followed by suitable consolidation processes such as arc melting or electron-beam melting.
- The hydrolysis of many hygroscopic salts used as electrolytes and solvents can cause problems when used on a large scale, requiring significant peripheral handling facilities.
- The high volatility of many high-valency refractory-metal halides, especially chlorides, and the tendency of their lower-valency halides, especially chlorides, to form insoluble cluster-type compounds. The disproportionation of intermediate-valency-state compounds can also cause issues. Additionally, in the case of the concomitant anodic reaction, energy considerations often conflict with cathode product purity due to the nature of refractory metals and the small scale of operations. Practical limitations can arise from factors such as the corrosion of cell and electrode materials. Material problems can also occur due to the oxidation of lower-valency-state compounds by anode products, such as chlorine, necessitating the use of porous diaphragms, which can be more easily corroded by the melts than the bulk materials due to the large surface areas involved if they are inorganic.
4. Electrodeposition of Metal Coatings
Metal/Alloy Deposition | Molten Salt Mixture | Metal Precursor | Temp./K | Electrodes | Refs. | |||
---|---|---|---|---|---|---|---|---|
WE | CE | RE | ||||||
Refractory Metals and Alloys | Mo | EMPyrCl-ZnCl2 | MoCl3, MoCl5 | 473, 423 | Ni | Zn | Zn | [66] |
W | ZnCl2-NaCl-KCl-KF | WO3 | 523 | Ni | Glassy carbon | Zn | [67] | |
Mo-W | Me2WO4− Na2MoO4 (Me = Li, Na, K, Rb) | Me2WO4- Na2MoO4 | 1173–1323 | Ni/Steel | Graphite | O2 (Pt)|Na2WO4 −20 mol % WO3 | [68] | |
Light Metals and Alloys | Al | AlCl3-NaCl-KCl | AlCl3 | 448 | Mild steel | - | - | [69] |
Mg-Li | LiCl-KCl | Mg | 723 | Mo/Mg | graphite rod | - | [70] | |
Mg-Li-Zn | LiCl-KCl | MgCl2-ZnCl2 | 943 | Mo | graphite rod | Ag wire|AgCl in LiCl-KCl melts | [71] | |
Al-Cr-Ni | AlCl3-NaCl-KCl | CrCl2-NiCl2 | 423 | glassy carbon | pure-aluminum plate | Pure-Al rod|AlCl3-NaCl-KCl melt | [72] | |
Mg-Zn-Li-Ca | LiCl-KCl-MgCl2-ZnCl2-CaCl2 | LiCl-MgCl2-ZnCl2-CaCl2 | 943 | Mo | graphite rod | LiCl-KCl-AgCl (1%) | [73] | |
Transition Metals and Alloys | Ti | KF-KCl | K3TiF6 | 923 | Ni | Pt | - | [74] |
Si | KF-KCl | K2SiF6-SiCl4 | 923–1023 | Graphite | Graphite | - | [74] | |
Ni | LiF-NaF-KF | Nickel-based superalloy Inconel 718 | 923 | Pt | Mo | Pt/graphite rod | [75] | |
Fe-Si | NaCl-KCl-NaF | SiO2 | - | Steel | - | - | [76] | |
Co/Zn-Co | zinc chloride-1-ethyl-3-methylimidazolium chloride | ZnCl2-CoCl2 | 353 | W/Cu/Ni/glassy carbon | zinc spiral|ZnCl2-EMIC melt | Zn wire|ZnCl2-EMIC melt | [77] | |
Rare earth metals and Alloys | Al-Li-Y | LiCl-KCl | AlCl3-Y2O3 | 753 | Mo wire | pure-graphite rod | Ag wire|AgCl in LiCl-KCl melts | [78] |
Al-Yb | LiCl-KCl | AlCl3- Yb2O3 | 750 | W/Al | pure-graphite rod | Ag wire|AgCl in LiCl-KCl melts | [79] | |
LaNi5/Ni-S | Na3AlF6-La2O3-Al2O3 | - | 1273 | Ni wire | graphite rod | - | [80] | |
Sm-Ni | LiCl-KCl | SmCl3 | 723 | Mo/Ni | glassy carbon/Al plate | Ag wire|LiCl-KCl | [81] | |
Mg-Yb | LiCl-KCl | YbCl3 | 773 | Mg rod | pure-graphite rod | Ag wire|AgCl in LiCl-KCl melts | [82] | |
Metals containing ceramics | TiB2 | LiF-NaF-KF | K2TiF6-KBF4 | 973 | Mo | - | - | [83] |
TiB2 | KCl-KF | K2TiF6-KBF4 | 1083 | graphite | - | - | [84] | |
MgB2 | MgCl2-KCl-NaCl | MgB2O4 | 873 | graphite | graphite rod | - | [85] | |
Ta2C | LiF-NaF-KF | KeTaF7, K2CO3 | 1023–1050 | Ta/C | Ni | - | [86] | |
Mo₂C | LiF-NaF-KF | Li2MoO4, K2CO3 | 873 | Pt wire | pyrolytic graphite | - | [87] |
4.1. Emerging Refractory-Metal Depositions
4.1.1. Mo Metal Depositions
- Nitta et al. tested a novel molten salt system, N-ethyl-N-methyl-pyrrolidinium chloride (EMPyrCl)-ZnCl2, for Mo electrodeposition at intermediate temperatures. The phase diagram for the EMPyrCl-ZnCl2 system reveals the lowest melting point (318 K) for an equimolar mixture demonstrated, to date; however the actual electrodeposition of a smooth metallic Mo layer on a nickel substrate occurred at higher temperatures, both in an equimolar melt containing MoCl5 and KF (423 K) and in an equimolar melt containing MoCl3 and KF (473 K) [66].
4.1.2. W Metal Depositions
- Nakajima and colleagues demonstrate that WO3 does not dissolve well in a ZnCl2–NaCl–KCl melt at 523 K. However, when KF is added to the melt, the solubility of WO3 increases, enabling the electrodeposition of a dense metallic tungsten film. A potentiostatic electrolysis at 0.06 V versus Zn(II)/Zn produced a smooth, fine (2.5 µm) film of metallic tungsten on a nickel substrate after 6 h of electrolysis, offering a new mechanism for low-temperature W electrodeposition [67].
- Nitta and colleagues attempted to enable thicker W electrodeposition in a ZnCl2-NaCl-KCl-KF-WO3 melt at 523 K. After 6 h in the standard electrolysis procedure [0.08 V vs. Zn(II)/Zn], the current density was reduced from 1.2 mAcm−2 to 0.3 mAcm−2, resulting in a thin W layer (2.1 µm) with a predicted current efficiency of 93%. An ICP-AES and XRD analysis of the melt’s supernatant and bottom salts revealed that the soluble W entities (the WO3F anions) had slowly turned into insoluble entities (ZnWO4 and K2WO2F4). Consequently, adjusting the electrodeposition process to include an additional dose of WO3 every 2 h preserved the original current density and produced a denser (4.2 µm) tungsten film. The intermittent addition of WO3 has also been shown to be beneficial in producing a denser tungsten film [88].
- Nitta’s team also investigated Li2WO4-Na2WO4-K2WO4 and its derived melts at 873K, with the goal of developing a stable method for high-quality W electrodeposition. For the Li2WO4-Na2WO4-K2WO4 melt, galvanostatic electrolysis at 25 mAcm−2 produced a W and tungsten oxide deposit; in the same conditions, the Li2WO4-Na2WO4-K2WO4 -LiCl-NaCl-KCl melt produced a dendritic W, presumably due to the solution’s decreased viscosity. In s repeated attempt to prevent dendrite growth, they first vibrated the electrode during electrodeposition (which produced a deposit coated in big, angular crystal grains) and then added a small amount of KF (which produced shorter crystal grains and a more-uniform surface due to the inhibition of α-W crystal development, allowing for the formation of a combination of α-W and β-W). They also produced a remarkably thick (9.7 µm) W sheet, following 1 h of electrolysis at 25 mAcm−2 [89].
- Jiang and colleagues discovered that they could generate a smooth and compact W coating on a Mo substrate by electrodepositing a molten salt of Na2WO4-WO3 at 1173 K in the presence of air. The W covering had a columnar structure with a growth orientation that was primarily toward (2 0 0). In the Mo substrate, a 2 μm-thick W diffusion layer was created, and the W coating adhered effectively to the substrate. Mutual diffusion between the coating and the substrate was promoted at high temperatures. The adhesion of the W coatings to the Mo substrates was robust. As the cathodic current density increased, the thickness of the W coatings also increased, but the grain size decreased [45].
- Jiang and colleagues were able to deposit pure-W covering with a body-centered cubic structure from molten Na2WO4-WO3-NaPO3 salt in an air atmosphere at 1153K. With a thin W diffusion layer in the Cu substrate, the coatings had an inner layer of tooth-like grains and an exterior layer of columnar grains. The researchers looked at the impact of current density and electrodeposition duration on the morphology and microstructure of the coatings. As the current density increased, the grain size of the W coating also increased. Simultaneously, the coating’s thickness initially increased and then decreased with the rising current density. Furthermore, the preferred orientation of the coatings shifted from (2 2 0) to (2 1 1). Interestingly, this preference for the (2 1 1) orientation remained constant, even as the duration was extended. Direct-current electrodeposition is not suited for thick-W-coating electroplating due to the low current efficiency for lengthy electrodeposition durations [90].
4.1.3. Mo and W Alloys
- Malyshev et al. carried out research to identify the best techniques for Mo-W alloy electrodeposition. They evaluated the impact of molybdenum(VI) oxide content and melt cationic composition on the nature and properties of the cathode product. Experiments were carried out at 1173 K with the cathode the density of current of 5 Adm−2 using melts of Me2WO4-Na2MoO4 (Me = Li, Na, K, and Rb). The researchers discovered that a high MoO3 concentration in the melt caused the formation of molybdenum(VI) oxide, rather than metallic Mo. As the alkali metal cation radius rose in the sequence Li2WO4 < Na2WO4 < K2WO4 < Rb2WO4, the minimum concentration of MoO3 that produced deposition changed from 2.0 to 8.5 mol%. When the MoO3 concentration was less than 1.0 mol.%, Mo-W alloys with 1–5 at.% W contents were deposited at the cathode, regardless of the cationic composition. Metallic Mo was deposited at higher MoO3 concentrations. They discovered that the alloy’s Mo content was raised with MoO3 concentration and diminished with WO3 concentration and cathodic current density [68].
4.1.4. Ta Metal Depositions
- Mehmood and colleagues successfully deposited a solid coating of pure-Ta on W using a LiF-NaF-CaF2 melt that contained 2% K2TaF7. Galvanostatic polarization was used to deposit the Ta. When a high current density of 1.5 kAm−2 was applied, the deposited coating contained some porosity, due to dendritic growth. At very low current densities of 0.15–0.2 kAm−2, nucleation of the deposit was difficult because of a comproportionation reaction, resulting in the lack of deposit on most of the surface. However, the reaction product was soluble and diffused away from the electrode, preventing contamination of the deposit [91].
4.1.5. Ta and W Alloys
- Lee and colleagues investigated coatings of Ta-W (Ta-7.31 W, Ta-4.12 W, and Ta-1.92 W), utilizing a multi-anode reactive-alloy coating technique in molten salt (LiF-NaF-K2TaF7) at various cathode–anode distances. The Ta-4.12 W coating had a corrosion rate in hydriodic acid of less than 0.0087 mm/year at 433 K and a thickness uniformity of 30 ± 0.7 µm. The resultant coating layer was also found to be up to 12.9% harder than a pure-Ta plating layer. When compared to pure Ta, these alloy coating films considerably improved corrosion resistance and mechanical qualities [92].
4.1.6. Re Metal Depositions
- Chernyshev et al. investigated the behavior of Re ions in a molten KF-KBF4-B2O3 salt using a three-electrode electrochemical cell at 773 K. Their research aimed to obtain highly pure metallic rhenium (99.98%) with a filamentous structure at the cathode. The study utilized cyclic voltammetry, stationary galvanostatic, and polarization curve analyses, to determine the reduction and diffusion mechanisms of Re ions within the molten salt. The results showed that the electrodeposition of Re at a constant potential was a one-step reaction from Re(VII) to Re, occurring from two types of complex rhenium ions, KReO4 and K3ReO5 [93].
- Wang et al. conducted a study on the characteristics of Re coatings deposited in ternary melts of NaCl-KCl-CsCl. The coatings were electrodeposited at current densities ranging from 20 to 250 mAcm−2 and temperatures from 973 to 1150 K. The study found that the growth mechanism of the coatings changed from lateral growth with a preferred crystal plane of (002) to outward growth with a preferred crystal plane of (110) as current density increased or temperature decreased. The morphologies of the coatings included faceted grains, dendritic powder, and surface structures resembling pyramids, starfish, and intertwined roots. The researchers identified the optimal deposition-process parameters for producing dense and smooth Re coatings to be a temperature range of 1073–1123 K and a current density of 50–100 mAcm−2 [94].
4.1.7. Nb Metal Depositions
- Chernyshev and colleagues proposed the deposition of high-quality, thick, dense, and adhesive Nb coatings using a CsBr-KBr-NbBr3 melt as an electrolytic solution. When compared to the regularly used fluoride and chloride electrolytic solution, this melt was shown to be less harsh and provide greater rate of deposition of dense Nb layers. The researchers looked at how temperature and cathode current density affected the structure and morphology of the Nb coatings during electrodeposition. The researchers utilized cyclic voltammetry to investigate the cathode process in CsBr-KBr-NbBr3 melts with varying Nb concentrations at temperatures ranging from 893 to 1013 K. A two-stage mechanism involving Nb(III) and Nb(II) ions was hypothesized, and the efficient coefficient of diffusion of Nb cations in bromide melt was determined using the results of cyclic voltammetry and numerical simulation data [95].
- Cheek and colleagues investigated the electrochemical processes of Nb(V) in acidic AlCl3: 1-ethyl-3-methylimidazolium chloride (EMIC) melts in depth. They found that reduction occurs in several one-electron stages that are largely irreversible. The existence of insoluble Nb(IV) species complicates the voltammetry. They discovered that the lowest-valent species that experiences reduction before the commencement of aluminum reduction is Nb(III). When Nb powder is introduced to the acidic AlCl3: EMIC melts, a low-valent species, possibly Nb(III), develops slowly in the melt. Electrodeposition from Nb(V)-containing solutions, on the other hand, is less successful. Earlier reduction of NbCl5 through the addition of Nb powder to acidic AlCl3: EMIC melts, on the other hand, enables the deposition of stable and homogeneous films containing up to 15% Nb [96].
4.2. Characterization of Molten Salt and Refractory Metals
5. Propensity for Advancement
- To optimize the quality of materials for increasingly demanding and specific applications, we urgently need more fundamental research into the mechanics of high-temperature molten salt deposition, which necessitates deeper investigation into the interaction between the molten salt coatings’ fabrication variables, characteristics, structures, associated electrochemical processes, and growth mechanisms. The versatility of molten salt electrodeposition is tied to its greater operating-temperature range and wider electrochemical window, but we have much to learn about the specific impacts of the variables, including the molten salt components, operation temperature, electrochemical parameters (e.g., potential, current, time, and electrodeposition mode), and electrochemical techniques (e.g., pulse current, pulse potential, constant current, and constant potential), which all impact the nucleation and growth process, and, thus, the morphology, microstructure, and composition of the final product (e.g., surface quality, depth gradient, imperfections, and stresses). Fundamental investigation of the physical and chemical mechanisms of molten salt electrodeposition will provide the insight required to develop better metal-doping alloys to meet specific application needs, and even provide fresh inspiration for new applications.
- The development of in situ characterization for molten salt electrodeposition is projected to provide a significant contribution to the basic comprehension of electrochemical reactions, processes, and side reactions. This characterization may allow us to expand the existing repertoire of molten salt compounds (metal chlorides, fluorides, nitrates, sulphates, and oxides) with complex (binary, ternary, quaternary, etc.) compositions. whose component ratios are optimized for specific deposition materials and application requirements. Further investigation into the mechanisms of the electrochemical process (including side reactions, unanticipated formations, and inorganic molecular processes) will also enhance our ability to reliably produce high-purity coatings and avoid unwanted reactions.
- Molten salt processes are often volatile and corrosive (especially at the highest temperatures), which can be environmentally damaging and may have a negative effect on electrodes, cell materials, and coatings. We need more research into the corrosion mechanisms of structural materials during molten salt electrodeposition; priority should be given to the investigation of corrosion-resistant materials, recyclable molten salts, and new options for minimal-temperature molten salt deposition.
6. Conclusions
Funding
Conflicts of Interest
References
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De Silva, U.; Coons, T.P. Molten Salt Electrodeposition: Review. Energies 2024, 17, 3832. https://doi.org/10.3390/en17153832
De Silva U, Coons TP. Molten Salt Electrodeposition: Review. Energies. 2024; 17(15):3832. https://doi.org/10.3390/en17153832
Chicago/Turabian StyleDe Silva, Umanga, and Timothy P. Coons. 2024. "Molten Salt Electrodeposition: Review" Energies 17, no. 15: 3832. https://doi.org/10.3390/en17153832
APA StyleDe Silva, U., & Coons, T. P. (2024). Molten Salt Electrodeposition: Review. Energies, 17(15), 3832. https://doi.org/10.3390/en17153832