Arumugam, S.; Haba, Y.; Pieterse, P.J.; Uhrlandt, D.; Kosleck, S.
Influence of Water Ingress on Surface Discharges Occurring on the Silicone Gel Encapsulated Printed Circuit Boards Developed for Deep-Sea Applications. Energies 2023, 16, 5353.
https://doi.org/10.3390/en16145353
AMA Style
Arumugam S, Haba Y, Pieterse PJ, Uhrlandt D, Kosleck S.
Influence of Water Ingress on Surface Discharges Occurring on the Silicone Gel Encapsulated Printed Circuit Boards Developed for Deep-Sea Applications. Energies. 2023; 16(14):5353.
https://doi.org/10.3390/en16145353
Chicago/Turabian Style
Arumugam, Saravanakumar, Yvonne Haba, Petrus Jacobus Pieterse, Dirk Uhrlandt, and Sascha Kosleck.
2023. "Influence of Water Ingress on Surface Discharges Occurring on the Silicone Gel Encapsulated Printed Circuit Boards Developed for Deep-Sea Applications" Energies 16, no. 14: 5353.
https://doi.org/10.3390/en16145353
APA Style
Arumugam, S., Haba, Y., Pieterse, P. J., Uhrlandt, D., & Kosleck, S.
(2023). Influence of Water Ingress on Surface Discharges Occurring on the Silicone Gel Encapsulated Printed Circuit Boards Developed for Deep-Sea Applications. Energies, 16(14), 5353.
https://doi.org/10.3390/en16145353