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Journal: Energies, 2019
Volume: 12
Number: 2391

Article: Thermal Fatigue Modelling and Simulation of Flip Chip Component Solder Joints under Cyclic Thermal Loading
Authors: by Liangyu Wu, Xiaotian Han, Chenxi Shao, Feng Yao and Weibo Yang
Link: https://www.mdpi.com/1996-1073/12/12/2391

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