Order Article Reprints

Dong H, Liu H, Nishimura A, Wu Z, Zhang H, Han Y, Wang T, Wang Y, Huang C, Li L. Monitoring Strain Response of Epoxy Resin during Curing and Cooling Using an Embedded Strain Gauge. Sensors. 2021; 21(1):172. https://doi.org/10.3390/s21010172

Dong, Hongyu, Huiming Liu, Arata Nishimura, Zhixiong Wu, Hengcheng Zhang, Yemao Han, Tao Wang, Yongguang Wang, Chuanjun Huang, and Laifeng Li. 2021. "Monitoring Strain Response of Epoxy Resin during Curing and Cooling Using an Embedded Strain Gauge" Sensors 21, no. 1: 172. https://doi.org/10.3390/s21010172

Dong, H., Liu, H., Nishimura, A., Wu, Z., Zhang, H., Han, Y., Wang, T., Wang, Y., Huang, C., & Li, L. (2021). Monitoring Strain Response of Epoxy Resin during Curing and Cooling Using an Embedded Strain Gauge. Sensors, 21(1), 172. https://doi.org/10.3390/s21010172