Monitoring Strain Response of Epoxy Resin during Curing and Cooling Using an Embedded Strain Gauge
Dong, H.; Liu, H.; Nishimura, A.; Wu, Z.; Zhang, H.; Han, Y.; Wang, T.; Wang, Y.; Huang, C.; Li, L. Monitoring Strain Response of Epoxy Resin during Curing and Cooling Using an Embedded Strain Gauge. Sensors 2021, 21, 172. https://doi.org/10.3390/s21010172
Dong H, Liu H, Nishimura A, Wu Z, Zhang H, Han Y, Wang T, Wang Y, Huang C, Li L. Monitoring Strain Response of Epoxy Resin during Curing and Cooling Using an Embedded Strain Gauge. Sensors. 2021; 21(1):172. https://doi.org/10.3390/s21010172
Chicago/Turabian StyleDong, Hongyu, Huiming Liu, Arata Nishimura, Zhixiong Wu, Hengcheng Zhang, Yemao Han, Tao Wang, Yongguang Wang, Chuanjun Huang, and Laifeng Li. 2021. "Monitoring Strain Response of Epoxy Resin during Curing and Cooling Using an Embedded Strain Gauge" Sensors 21, no. 1: 172. https://doi.org/10.3390/s21010172