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Journal: Sensors, 2020
Volume: 20
Number: 2133

Article: Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems
Authors: by Anna Persano, Fabio Quaranta, Antonietta Taurino, Pietro Aleardo Siciliano and Jacopo Iannacci
Link: https://www.mdpi.com/1424-8220/20/7/2133

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