Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer
1
MOE Key Laboratory of Fundamental Physical Quantities Measurement, School of Physic, Huazhong University of Science and Technology, Wuhan 430074, China
2
Institute of Geophysics and PGMF, Huazhong University of Science and Technology, Wuhan 430074, China
*
Authors to whom correspondence should be addressed.
Sensors 2020, 20(4), 1186; https://doi.org/10.3390/s20041186
Received: 10 January 2020
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Revised: 4 February 2020
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Accepted: 19 February 2020
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Published: 21 February 2020
(This article belongs to the Special Issue Fabrication, Modeling and Integration of a Silicon Technology Based Sensor)
Capacitive MEMS accelerometers with area-variable periodic-electrode displacement transducers found wide applications in disaster monitoring, resource exploration and inertial navigation. The bonding-induced warpage, due to the difference in the coefficients of thermal expansion of the bonded slices, has a negative influence on the precise control of the interelectrode spacing that is essential to the sensitivity of accelerometers. In this work, we propose the theory, simulation and experiment of a method that can alleviate both the stress and the warpage by applying different bonding temperature on the bonded slices. A quasi-zero warpage is achieved experimentally, proving the feasibility of the method. As a benefit of the flat surface, the spacing of the capacitive displacement transducer can be precisely controlled, improving the self-noise of the accelerometer to 6 ng/√Hz @0.07 Hz, which is about two times lower than that of the accelerometer using a uniform-temperature bonding process.
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MDPI and ACS Style
Liu, D.; Liu, H.; Liu, J.; Hu, F.; Fan, J.; Wu, W.; Tu, L. Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer. Sensors 2020, 20, 1186. https://doi.org/10.3390/s20041186
AMA Style
Liu D, Liu H, Liu J, Hu F, Fan J, Wu W, Tu L. Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer. Sensors. 2020; 20(4):1186. https://doi.org/10.3390/s20041186
Chicago/Turabian StyleLiu, Dandan, Huafeng Liu, Jinquan Liu, Fangjing Hu, Ji Fan, Wenjie Wu, and Liangcheng Tu. 2020. "Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer" Sensors 20, no. 4: 1186. https://doi.org/10.3390/s20041186
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