Park, C.; Jung, H.; Lee, H.; Hong, S.; Kim, H.; Cho, S.J.
One-Step Laser Encapsulation of Nano-Cracking Strain Sensors. Sensors 2018, 18, 2673.
https://doi.org/10.3390/s18082673
AMA Style
Park C, Jung H, Lee H, Hong S, Kim H, Cho SJ.
One-Step Laser Encapsulation of Nano-Cracking Strain Sensors. Sensors. 2018; 18(8):2673.
https://doi.org/10.3390/s18082673
Chicago/Turabian Style
Park, Chan, Hyunsuk Jung, Hyunwoo Lee, Sunguk Hong, Hyonguk Kim, and Seong J. Cho.
2018. "One-Step Laser Encapsulation of Nano-Cracking Strain Sensors" Sensors 18, no. 8: 2673.
https://doi.org/10.3390/s18082673
APA Style
Park, C., Jung, H., Lee, H., Hong, S., Kim, H., & Cho, S. J.
(2018). One-Step Laser Encapsulation of Nano-Cracking Strain Sensors. Sensors, 18(8), 2673.
https://doi.org/10.3390/s18082673