Next Article in Journal
New Vectorial Propulsion System and Trajectory Control Designs for Improved AUV Mission Autonomy
Next Article in Special Issue
Mechanical Characterization of Polysilicon MEMS: A Hybrid TMCMC/POD-Kriging Approach
Previous Article in Journal
Ultrasensitive Mach-Zehnder Interferometric Temperature Sensor Based on Liquid-Filled D-Shaped Fiber Cavity
Previous Article in Special Issue
PSPICE Hybrid Modeling and Simulation of Capacitive Micro-Gyroscopes
Article Menu
Issue 4 (April) cover image

Export Article

Open AccessArticle
Sensors 2018, 18(4), 1240;

Key Processes of Silicon-On-Glass MEMS Fabrication Technology for Gyroscope Application

1,2,* , 1,2
He Ministry of Education Key Lab of Micro/Nano Systems for Aerospace (Northwestern Polytechnical University), Ministry of Education, Xi’an 710072, China
Shaan’xi Key Lab of MEMS/NEMS, Northwestern Polytechnical University, Xi’an 710072, China
Author to whom correspondence should be addressed.
Received: 23 February 2018 / Revised: 13 April 2018 / Accepted: 13 April 2018 / Published: 17 April 2018
(This article belongs to the Collection Modeling, Testing and Reliability Issues in MEMS Engineering)
Full-Text   |   PDF [3368 KB, uploaded 3 May 2018]   |  


MEMS fabrication that is based on the silicon-on-glass (SOG) process requires many steps, including patterning, anodic bonding, deep reactive ion etching (DRIE), and chemical mechanical polishing (CMP). The effects of the process parameters of CMP and DRIE are investigated in this study. The process parameters of CMP, such as abrasive size, load pressure, and pH value of SF1 solution are examined to optimize the total thickness variation in the structure and the surface quality. The ratio of etching and passivation cycle time and the process pressure are also adjusted to achieve satisfactory performance during DRIE. The process is optimized to avoid neither the notching nor lag effects on the fabricated silicon structures. For demonstrating the capability of the modified CMP and DRIE processes, a z-axis micro gyroscope is fabricated that is based on the SOG process. Initial test results show that the average surface roughness of silicon is below 1.13 nm and the thickness of the silicon is measured to be 50 μm. All of the structures are well defined without the footing effect by the use of the modified DRIE process. The initial performance test results of the resonant frequency for the drive and sense modes are 4.048 and 4.076 kHz, respectively. The demands for this kind of SOG MEMS device can be fulfilled using the optimized process. View Full-Text
Keywords: SOG; SOI; fabrication; CMP; gyroscope; MEMS SOG; SOI; fabrication; CMP; gyroscope; MEMS

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

Share & Cite This Article

MDPI and ACS Style

Ma, Z.; Wang, Y.; Shen, Q.; Zhang, H.; Guo, X. Key Processes of Silicon-On-Glass MEMS Fabrication Technology for Gyroscope Application. Sensors 2018, 18, 1240.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics



[Return to top]
Sensors EISSN 1424-8220 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top