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Sensors 2017, 17(7), 1511;

Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors

Institute for Micro Assembly Technology, Hahn-Schickard e. V, Allmandring 9B, 70569 Stuttgart, Germany
Institut für Mikroelektronik Stuttgart, Allmandring 30a, 70569 Stuttgart, Germany
Institute for Micro Integration (IFM), University of Stuttgart, Allmandring 9B, 70569 Stuttgart, Germany
Author to whom correspondence should be addressed.
Received: 8 April 2017 / Revised: 12 June 2017 / Accepted: 21 June 2017 / Published: 27 June 2017
(This article belongs to the Special Issue MEMS and Nano-Sensors)
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Packaging represents an important part in the microintegration of sensors based on microelectromechanical system (MEMS). Besides miniaturization and integration density, functionality and reliability in combination with flexibility in packaging design at moderate costs and consequently high-mix, low-volume production are the main requirements for future solutions in packaging. This study investigates possibilities employing printed circuit board (PCB-)based assemblies to provide high flexibility for circuit designs together with film-assisted transfer molding (FAM) to package sensors. The feasibility of FAM in combination with PCB and MEMS as a packaging technology for highly sensitive inertia sensors is being demonstrated. The results prove the technology to be a viable method for damage-free packaging of stress- and pressure-sensitive MEMS. View Full-Text
Keywords: packaging; MEMS; EMC; FAM; button shear test packaging; MEMS; EMC; FAM; button shear test

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Hera, D.; Berndt, A.; Günther, T.; Schmiel, S.; Harendt, C.; Zimmermann, A. Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors. Sensors 2017, 17, 1511.

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