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Journal: Sensors, 2017
Volume: 17
Number: 1511
Article:
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors
Authors:
by
Daniel Hera, Armin Berndt, Thomas Günther, Stephan Schmiel, Christine Harendt and André Zimmermann
Link:
https://www.mdpi.com/1424-8220/17/7/1511
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