Asano, S.;                     Muroyama, M.;                     Nakayama, T.;                     Hata, Y.;                     Nonomura, Y.;                     Tanaka, S.    
        3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer. Sensors 2017, 17, 2451.
    https://doi.org/10.3390/s17112451
    AMA Style
    
                                Asano S,                                 Muroyama M,                                 Nakayama T,                                 Hata Y,                                 Nonomura Y,                                 Tanaka S.        
                3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer. Sensors. 2017; 17(11):2451.
        https://doi.org/10.3390/s17112451
    
    Chicago/Turabian Style
    
                                Asano, Sho,                                 Masanori Muroyama,                                 Takahiro Nakayama,                                 Yoshiyuki Hata,                                 Yutaka Nonomura,                                 and Shuji Tanaka.        
                2017. "3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer" Sensors 17, no. 11: 2451.
        https://doi.org/10.3390/s17112451
    
    APA Style
    
                                Asano, S.,                                 Muroyama, M.,                                 Nakayama, T.,                                 Hata, Y.,                                 Nonomura, Y.,                                 & Tanaka, S.        
        
        (2017). 3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer. Sensors, 17(11), 2451.
        https://doi.org/10.3390/s17112451