Wu, J.;                     Lei, L.;                     Chen, X.;                     Cai, X.;                     Li, Y.;                     Han, T.    
        A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology. Sensors 2014, 14, 20533-20542.
    https://doi.org/10.3390/s141120533
    AMA Style
    
                                Wu J,                                 Lei L,                                 Chen X,                                 Cai X,                                 Li Y,                                 Han T.        
                A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology. Sensors. 2014; 14(11):20533-20542.
        https://doi.org/10.3390/s141120533
    
    Chicago/Turabian Style
    
                                Wu, Junjie,                                 Lihua Lei,                                 Xin Chen,                                 Xiaoyu Cai,                                 Yuan Li,                                 and Tao Han.        
                2014. "A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology" Sensors 14, no. 11: 20533-20542.
        https://doi.org/10.3390/s141120533
    
    APA Style
    
                                Wu, J.,                                 Lei, L.,                                 Chen, X.,                                 Cai, X.,                                 Li, Y.,                                 & Han, T.        
        
        (2014). A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology. Sensors, 14(11), 20533-20542.
        https://doi.org/10.3390/s141120533