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Sensors 2011, 11(6), 6257-6269;

Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate

Department of Power Mechanical Engineering, National Tsing Hua University (NTHU), Hsinchu 30013, Taiwan
Department of Microelectromechanical Systems, United Microelectronics Corporation (UMC), Hsinchu 30078, Taiwan
Department of Device Development, Solid State System Corporation (3S), Hsinchu 30288, Taiwan
Author to whom correspondence should be addressed.
Received: 21 April 2011 / Revised: 30 May 2011 / Accepted: 31 May 2011 / Published: 10 June 2011
(This article belongs to the Section Physical Sensors)
Full-Text   |   PDF [1265 KB, uploaded 21 June 2014]


This study reports a CMOS-MEMS condenser microphone implemented using the standard thin film stacking of 0.35 μm UMC CMOS 3.3/5.0 V logic process, and followed by post-CMOS micromachining steps without introducing any special materials. The corrugated diaphragm for the microphone is designed and implemented using the metal layer to reduce the influence of thin film residual stresses. Moreover, a silicon substrate is employed to increase the stiffness of the back-plate. Measurements show the sensitivity of microphone is −42 ± 3 dBV/Pa at 1 kHz (the reference sound-level is 94 dB) under 6 V pumping voltage, the frequency response is 100 Hz–10 kHz, and the S/N ratio >55 dB. It also has low power consumption of less than 200 μA, and low distortion of less than 1% (referred to 100 dB). View Full-Text
Keywords: CMOS-MEMS; condenser microphone; corrugated; sensitivity; diaphragm CMOS-MEMS; condenser microphone; corrugated; sensitivity; diaphragm
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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Huang, C.-H.; Lee, C.-H.; Hsieh, T.-M.; Tsao, L.-C.; Wu, S.; Liou, J.-C.; Wang, M.-Y.; Chen, L.-C.; Yip, M.-C.; Fang, W. Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate. Sensors 2011, 11, 6257-6269.

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