Order Article Reprints

Huang C-H, Lee C-H, Hsieh T-M, Tsao L-C, Wu S, Liou J-C, Wang M-Y, Chen L-C, Yip M-C, Fang W. Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate. Sensors. 2011; 11(6):6257-6269. https://doi.org/10.3390/s110606257

Huang, Chien-Hsin, Chien-Hsing Lee, Tsung-Min Hsieh, Li-Chi Tsao, Shaoyi Wu, Jhyy-Cheng Liou, Ming-Yi Wang, Li-Che Chen, Ming-Chuen Yip, and Weileun Fang. 2011. "Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate" Sensors 11, no. 6: 6257-6269. https://doi.org/10.3390/s110606257

Huang, C.-H., Lee, C.-H., Hsieh, T.-M., Tsao, L.-C., Wu, S., Liou, J.-C., Wang, M.-Y., Chen, L.-C., Yip, M.-C., & Fang, W. (2011). Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate. Sensors, 11(6), 6257-6269. https://doi.org/10.3390/s110606257