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Review

Residual Stress in Epoxy-Based Insulators: Formation, Detection, and Reliability

State Key Laboratory of Smart Power Distribution Equipment and System, Tianjin University, Tianjin 300072, China
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Author to whom correspondence should be addressed.
Molecules 2026, 31(14), 2410; https://doi.org/10.3390/molecules31142410
Submission received: 20 May 2026 / Revised: 6 July 2026 / Accepted: 7 July 2026 / Published: 8 July 2026

Abstract

Gas-insulated switchgears (GISs) and gas-insulated transmission lines (GILs) are essential for large-capacity power transmission in demanding environments, such as high drops, large spans, and heavy pollution. As the core components providing both electrical insulation and mechanical support, ultra-high voltage (UHV) epoxy-based insulators often suffer from high internal residual stress. This issue, compounded by a lack of reliable detection methods, frequently results in equipment being commissioned with hidden defects. To address this, this review first examines the formation mechanisms of curing deformation and residual stress in oversized insulators based on cure kinetics and thermo-chemical coupling models. Subsequently, it provides a comprehensive summary of current residual stress measurement techniques, comparing the applicability and limitations of embedded sensors, direct mechanical measurements, and indirect non-destructive testing (NDT) methods. Finally, by coupling residual stress with filler sedimentation, the stress distribution patterns and mechanical reliability of epoxy-based insulators across different life-cycle stages are analyzed. These insights offer valuable theoretical references for the structural design, process optimization, and performance evaluation of oversized epoxy-based insulators, ultimately contributing to the intrinsic safety of UHV power equipment.
Keywords: GIL; epoxy-based insulator; residual stress; detection method; mechanical reliability GIL; epoxy-based insulator; residual stress; detection method; mechanical reliability

Share and Cite

MDPI and ACS Style

Li, J.; Chen, S.; Liang, H.; Du, B. Residual Stress in Epoxy-Based Insulators: Formation, Detection, and Reliability. Molecules 2026, 31, 2410. https://doi.org/10.3390/molecules31142410

AMA Style

Li J, Chen S, Liang H, Du B. Residual Stress in Epoxy-Based Insulators: Formation, Detection, and Reliability. Molecules. 2026; 31(14):2410. https://doi.org/10.3390/molecules31142410

Chicago/Turabian Style

Li, Jin, Siyuan Chen, Hucheng Liang, and Boxue Du. 2026. "Residual Stress in Epoxy-Based Insulators: Formation, Detection, and Reliability" Molecules 31, no. 14: 2410. https://doi.org/10.3390/molecules31142410

APA Style

Li, J., Chen, S., Liang, H., & Du, B. (2026). Residual Stress in Epoxy-Based Insulators: Formation, Detection, and Reliability. Molecules, 31(14), 2410. https://doi.org/10.3390/molecules31142410

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