Residual Stress in Epoxy-Based Insulators: Formation, Detection, and Reliability
Abstract
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Li, J.; Chen, S.; Liang, H.; Du, B. Residual Stress in Epoxy-Based Insulators: Formation, Detection, and Reliability. Molecules 2026, 31, 2410. https://doi.org/10.3390/molecules31142410
Li J, Chen S, Liang H, Du B. Residual Stress in Epoxy-Based Insulators: Formation, Detection, and Reliability. Molecules. 2026; 31(14):2410. https://doi.org/10.3390/molecules31142410
Chicago/Turabian StyleLi, Jin, Siyuan Chen, Hucheng Liang, and Boxue Du. 2026. "Residual Stress in Epoxy-Based Insulators: Formation, Detection, and Reliability" Molecules 31, no. 14: 2410. https://doi.org/10.3390/molecules31142410
APA StyleLi, J., Chen, S., Liang, H., & Du, B. (2026). Residual Stress in Epoxy-Based Insulators: Formation, Detection, and Reliability. Molecules, 31(14), 2410. https://doi.org/10.3390/molecules31142410

