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Journal: Molecules, 2025
Volume: 30
Number: 2960
Article:
Investigation on the Underlying Mechanisms of the Mechanical and Electrical Enhancement of Nano-SiO2-Doped Epoxy Resins: A Molecular Simulation Study
Authors:
by
Kunqi Cui, Yang Wang, Wenchao Yan, Teng Cao, Yan Du, Kai Wu and Li Guo
Link:
https://www.mdpi.com/1420-3049/30/14/2960
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