Search Results (7)

Laser trepan drilling and laser helical drilling are typical methods for fabrication of micro through-holes through scanning laser beam. In the drilling process, the subsequent laser pulse may be occluded by the edge and the sputter deposition at the edge of the previous drilled trench. Dynamic focus feeding and widening path can be employed to lessen the occlusion effect and both of them are always employed in laser helical drilling. However, Widening the trench needs to remove more volume of material and may bring certain negative effects such as lowering the recoil pressure as well as less splashing melt due to the limited constraint of trench wall. The effects of dynamic feeding the focal plane and widening the scanning path on the quality and efficiency in the nanosecond laser drilling process were investigated through laser drilling holes with diameter of 500 μm on a 300 μm thick GH4169 plate. Results show that dynamic focus feeding is beneficial in both drilling efficiency and drilling quality. Through laser helical drilling with dynamic focus feeding, micro through-hole can be fabricated in 5 s, and both smaller tilting angle of 0.073 rad and smaller heat-affected zone of 0.63 mm in radius can be obtained. Widening scanning path is helpful to perforating rapidly but leads to much more recast layer coating. the quality of the micro through-holes depends not only on the utilization efficiency of the laser energy, but also on high temperature spatter deposition, which is the source of the difference between different drilling strategies. Due to the low cost in equipment and the better hole quality, the laser drilling, especially laser helical drilling, has potential applications ranging from aerospace fields to normal fields such as the agricultural machinery industry. Full article

To optimize the laser drilling process and reduce the processing time, this study investigates picosecond laser trepan drilling on the titanium alloy TC4, analyzing the effects of laser parameters on micro-hole diameter, taper, and roundness. Four independent variables were selected: laser power, defocusing distance, scanning speed, and the number of scans. An L₂₅ (5⁶) orthogonal array was employed for experimental design. The mean response and range analyses evaluated parameter impacts on micro-hole quality, revealing the influence mechanisms of these variables at different levels. The results indicate the following: (1) the scanning speed and laser power significantly affect entrance and exit micro-hole diameters; (2) the defocusing distance substantially influences micro-hole taper; (3) the laser power most critically impacts inlet roundness; (4) the defocusing distance, scanning speed, and laser power directly correlate with outlet roundness; (5) the number of scans exhibits weaker relationships with inlet/outlet diameters, taper, and roundness. A comprehensive balance method applied to orthogonal test results for process optimization yielded the following optimal parameters: 90% laser power (30 W total), −0.2 mm defocus, a 27 mm/s scanning speed, and 15 scans. Full article

Nuclear power tube plates are made from the high-strength, low-carbon alloy steel SA-5083, which has high values of toughness and plasticity, though it is forged with poor consistency and entails serious work hardening. It requires a large number of deep holes with a high machining accuracy and high surface quality to be processed. However, the quality of the processed holes is often not up to the standard of the Boring and Trepanning Association (BTA) for the deep-hole drilling of tube plates; this has led to deep-hole processing becoming a bottleneck in the manufacture of steam generators for the main equipment of nuclear power islands. The variation laws of the diameter, roundness, perpendicularity, roughness, microhardness, and residual stress in relation to the feed, speed, and drilling depth are explored in the macro- and micro-dimensions; also explored is the wear morphology of BTA drills. The internal influence mechanisms between them are revealed in order to provide a scientific basis for the control of surface quality and machining accuracy as well as the optimization of process parameters. Our research results indicate that the guide block wear is mainly concentrated at the top 1–2 mm and that the drilling depth and feed have a great influence on the machining diameter. The hole wall roughness is between 0.3 and 0.6 μm, the maximum microhardness is about 2.15 times the hardness of the matrix material, and the residual stress is compressive stress. With increases in the feed and drilling depth, the hole diameter and the roughness increase. With an increase in the speed, the roughness decreases and the compressive stress of the BTA deep-hole drilling wall increases. Full article

Micro-drilling transparent dielectric materials by using non-diffracting beams impinging orthogonally to the sample can be performed without scanning the beam position along the sample thickness. In this work, the laser micromachining process, based on the combination of picosecond pulsed Bessel beams with the trepanning technique, is applied to different transparent materials. We show the possibility to create through-apertures with diameter on the order of tens of micrometers, on dielectric samples with different thermal and mechanical characteristics as well as different thicknesses ranging from two hundred to five hundred micrometers. Advantages and drawbacks of the application of this technique to different materials such as glass, polymer, or diamond are highlighted by analyzing the features, the morphology, and the aspect-ratio of the through-holes generated. Alternative Bessel beam drilling configurations, and the possibility of optimization of the quality of the aperture at the output sample/air interface is also discussed in the case of glass. Full article

Bone substitute materials are becoming increasingly important in oral and maxillofacial surgery. Reconstruction of critical size bone defects is still challenging for surgeons. Here, we compared the clinically applied organic bone substitute materials NanoBone^® (nanocrystalline hydroxyapatite and nanostructured silica gel; n = 5) and Actifuse (calcium phosphate with silicate substitution; n = 5) with natural collagen-based Spongostan™ (hardened pork gelatin containing formalin and lauryl alcohol; n = 5) in bilateral rat critical-size defects (5 mm diameter). On topological level, NanoBone is known to harbour nanopores of about 20 nm diameter, while Actifuse comprises micropores of 200–500 µm. Spongostan™, which is clinically applied as a haemostatic agent, combines in its wet form both nano- and microporous topological features by comprising 60.66 ± 24.48 μm micropores accompanied by nanopores of 32.97 ± 1.41 nm diameter. Micro-computed tomography (µCT) used for evaluation 30 days after surgery revealed a significant increase in bone volume by all three bone substitute materials in comparison to the untreated controls. Clearly visual was the closure of trepanation in all treated groups, but granular appearance of NanoBone^® and Actifuse with less closure at the margins of the burr holes. In contrast, transplantion of Spongostan™ lead to complete filling of the burr hole with the highest bone volume of 7.98 ccm and the highest bone mineral density compared to all other groups. In summary, transplantation of Spongostan™ resulted in increased regeneration of a rat calvarial critical size defect compared to NanoBone and Actifuse, suggesting the distinct nano- and microtopography of wet Spongostan™ to account for this superior regenerative capacity. Since Spongostan™ is a clinically approved product used primarily for haemostasis, it may represent an interesting alternative in the reconstruction of defects in the maxillary region. Full article

Intense interest has been given to the fabrication of micro-through-holes with smaller tapering and higher aspect ratios in engineering ceramics due to their wide range of applications in MEMS and aerospace. A semi-water-immersed laser micro-trepanning (SWILT) scheme is proposed and investigated in this paper with alumina ceramics as the target material, and its performance is assessed and compared with the direct laser trepanning method. Relevant processing parameters influencing the trepanning process are explored through an orthogonally designed experiment, and their effects on hole profiles are adequately discussed to yield optimized parameters. It is revealed that SWILT is capable of producing micro-through-holes with minimized hole tapering and much straighter sidewalls compared with the direct trepanning results, whereas the ablated surface quality is relatively rougher. The micro-through-hole formation mechanisms are also amply analyzed, where the transition hole development may be purely attributed to the laser-material interaction in the direct laser trepanning condition, while the SWILT case features an enhanced material-removal rate, especially at the lower part of the through-hole. The latter is due to the strengthened mechanical effects coming from the water-confined plasma zone and the following cavitation bubble collapse, which may efficiently expel the molten material from sidewalls and result in significantly reduced hole tapering. Full article

The fabrication of micro-holes in silicon substrates that have a proper taper, higher depth-to-diameter ratio, and better surface quality has been attracting intense interest for a long time due to its importance in the semiconductor and MEMS (Micro-Electro-Mechanical System) industry. In this paper, an experimental investigation of the machining performance of the direct and chemical-assisted picosecond laser trepanning of single crystalline silicon is conducted, with a view to assess the two machining methods. The relevant parameters affecting the trepanning process are considered, employing the orthogonal experimental design scheme. It is found that the direct laser trepanning results are associated with evident thermal defects, while the chemical-assisted method is capable of machining micro-holes with negligible thermal damage. Range analysis is then carried out, and the effects of the processing parameters on the hole characteristics are amply discussed to obtain the recommended parameters. Finally, the material removal mechanisms that are involved in the two machining methods are adequately analyzed. For the chemical-assisted trepanning case, the enhanced material removal rate may be attributed to the serious mechanical effects caused by the liquid-confined plasma and cavitation bubbles, and the chemical etching effect provided by NaOH solution. Full article