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21 pages, 6102 KiB

Open AccessArticle

Optimization of MOSFET Copper Clip to Enhance Thermal Management Using Kriging Surrogate Model and Genetic Algorithm

by Yubin Cheon, Jaehyun Jung, Daeyeon Ki, Salman Khalid and Heung Soo Kim

Mathematics 2024, 12(18), 2949; https://doi.org/10.3390/math12182949 - 22 Sep 2024

Cited by 1 | Viewed by 1902

Metal–oxide–semiconductor field-effect transistors (MOSFETs) are critical in power electronic modules due to their high-power density and rapid switching capabilities. Therefore, effective thermal management is crucial for ensuring reliability and superior performance. This study used finite element analysis (FEA) to evaluate the electro-thermal behavior of MOSFETs with copper clip bonding, showing a significant improvement over aluminum wire bonding. The aluminum wire model reached a maximum temperature of 102.8 °C, while the copper clip reduced this to 74.6 °C. To further optimize the thermal performance, Latin Hypercube Sampling (LHS) generated diverse design points. The FEA results were used to select the Kriging regression model, chosen for its superior accuracy (MSE = 0.036, R² = 0.997, adjusted R² = 0.997). The Kriging model was integrated with a Genetic Algorithm (GA), further reducing the maximum temperature to 71.5 °C, a 4.20% improvement over the original copper clip design and a 43.8% reduction compared to aluminum wire bonding. This integration of Kriging and the GA to the MOSFET copper clip package led to a significant improvement in the heat dissipation and overall thermal performance of the MOSFET package, while also reducing the computational power requirements, providing a reliable and efficient solution for the optimization of MOSFET copper clip packages. Full article

(This article belongs to the Section E2: Control Theory and Mechanics)

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6 pages, 623 KiB

Open AccessProceeding Paper

Synthesis and Complexing Ability of a New Type of Molecular Clips Based on Diaza-18-crown-6 or Diamino-Dibenzo-18-crown-6 with Pendant p-tert-butylcalix[4]arenes

by Ekaterina Kulygina, Elena Alekseeva, Il’dar Rakipov and Tatiana Kirichenko

Chem. Proc. 2023, 14(1), 72; https://doi.org/10.3390/ecsoc-27-16129 - 15 Nov 2023

Viewed by 841

Abstract

A convenient method for obtaining a new type of molecular clips based on diazacrown or diamino-dibenzocrown ethers with two calixarene molecules attached to a central fragment using an amide bond was developed. Clip 1, based on diaza-18-crown-6, demonstrates exceptional selectivity toward barium in the alkaline earth metal series and forms 2:1 (L:M) complexes with copper and iron cations. With sodium and magnesium cations, clip 2, based on diamido-dibenzo-18-crown-6, forms 1:2 (L:M) complexes. The same compound interacts with cations of copper, iron, and cadmium to form 1:1 complexes with low stability constant values. Full article

(This article belongs to the Proceedings of 27th International Electronic Conference on Synthetic Organic Chemistry)

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11 pages, 1227 KiB

Open AccessArticle

Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters

by Md. Nazmul Hasan, Timothy Polom, Dominik Holzmann, Perla Malagó, Alfred Binder and Ali Roshanghias

Electronics 2022, 11(9), 1373; https://doi.org/10.3390/electronics11091373 - 25 Apr 2022

Cited by 3 | Viewed by 3054

Abstract

This paper demonstrates the feasibility of the printed copper (Cu) paste interconnects for applications in power semiconductor modules and switching converters. Copper sinter paste interconnects denoted as “Sinterconnects” have been recently introduced as an alternative to wire-bonding technology for power electronic device packaging. However, the electrical domain properties of these novel interconnects have not yet been investigated in detail. To address this research opportunity, this paper evaluates the performance of two different types of Sinterconnects applied to multi-chip, insulated gate bipolar transistor (IGBT) power modules. First, parasitic or stray inductances of these Sinterconnected systems are calculated analytically and by using three-dimensional finite element (FE) analysis. In addition to that, resistivity (

ρ

) of those has been analysed and compared with conventional wire bond technology. Finally, the performances of the Sinterconnects in power device assemblies are experimentally investigated. Two Sinterconnect structures (i.e., printed Cu paste and Cu clip attach) as well as a state-of-the-art wire-bonded IGBT module, have been integrated into a switching DC-DC converter and benchmarked. Experimental measurements show how converters with Sinterconnects enable efficient power conversion. Full article

(This article belongs to the Special Issue Interconnects for Electronics Packaging)

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13 pages, 4283 KiB

Open AccessArticle

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

by Ali Roshanghias, Perla Malago, Jaroslaw Kaczynski, Timothy Polom, Jochen Bardong, Dominik Holzmann, Muhammad-Hassan Malik, Michael Ortner, Christina Hirschl and Alfred Binder

Energies 2021, 14(8), 2176; https://doi.org/10.3390/en14082176 - 13 Apr 2021

Cited by 9 | Viewed by 6116

Abstract

Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, copper sinter paste was exploited as a fully printed interconnect and, additionally, as a copper clip-attach. The electrical and thermal performances of the copper-sinter paste interconnections (“sinterconnects”) were compared to a system with wire bonds. The results indicate comparable characteristics of the sinterconnect structures to the wire-bonded ones. Moreover, the performance of copper sinterconnects in a power module was further quantified at higher load currents via finite element analysis. It was identified that the full-area thermal and electrical contact facilitated by the planar sinterconnects can reduce ohmic losses and enhance the thermal management of the power packages. Full article

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