Search Results (7)

Soft lithography with microfabricated molds is a widely used manufacturing method. Recent advancements in 3D printing technologies have enabled microscale feature resolution, providing a promising alternative for mold fabrication. It is well established that the curing of PDMS is influenced by parameters such as temperature, time, and curing agent ratio. This study was conducted to address inconsistencies in PDMS curing observed when using different 3D-printed mold materials during the development of a Lab-on-a-Chip (LoC) system, which is typically employed for investigating the effect of hydrodynamic cavitation on blood clot disintegration. To evaluate the impact of mold material on PDMS curing behavior, PDMS was cast into molds made from polylactic acid (PLA), polyethylene terephthalate (PET), resin, and aluminum, and cured at controlled temperatures (55, 65, and 75 °C) for various durations (2, 6, and 12 h). Curing performance was assessed using Soxhlet extraction, Young’s modulus calculations derived from Atomic Force Microscopy (AFM), and complementary characterization methods. The results indicate that the mold material significantly affects PDMS curing kinetics due to differences in thermal conductivity and surface interactions. Notably, at 65 °C, PDMS cured in aluminum molds had a higher Young’s modulus (~1.84 MPa) compared to PLA (~1.23 MPa) and PET (~1.17 MPa), demonstrating that the mold material can be leveraged to tailor the mechanical properties. These effects were especially pronounced at lower curing temperatures, where PLA and PET molds offered better control over PDMS elasticity, making them suitable for applications requiring flexible LoC devices. Based on these findings, 3D-printed PLA molds show strong potential for PDMS-based microdevice fabrication. Full article

It is expected that ionic liquids will be used in the future as electrolytes for electric double layer capacitors, but currently microencapsulation with a conductive or porous shell is required for their fabrication. Here, we succeeded in fabricating a transparently gelled ionic liquid trapped in hemispherical silicone microcup structures just by observing with a scanning electron microscope (SEM), which allows the microencapsulation process to be eliminated and electrical contacts to be formed directly. To see the gelation, small amounts of ionic liquid were exposed to the SEM electron beam on flat aluminum, silicon, silica glass, and silicone rubber. The ionic liquid gelled on all the plates, and a color change to brown was observed on all the plates except for silicone rubber. This change might be caused by reflected and/or secondary electrons from the plates producing isolated carbon. Silicone rubber could remove the isolated carbon due to the large amount of oxygen inside it. Fourier transform infrared spectroscopy revealed that the gelled ionic liquid included a large amount of the original ionic liquid. Moreover, the transparent, flat gelled ionic liquid could also be made into three-layer structures on silicone rubber. Consequently, the present transparent gelation is suitable for silicone rubber-based microdevices. Full article

Heterogeneous integration of micro-electro mechanical systems (MEMS) and complementary metal oxide semiconductor (CMOS) integrated circuits (ICs) by 3D stacking or wafer bonding is an emerging approach to advance the functionality of microdevices. Aluminum (Al) has been of interest as one of the wafer bonding materials due to its low cost and compatibility with CMOS processes. However, Al wafer bonding typically requires a high temperature of 450 ${}^{°}$C or more due to the stable native oxide which presents on the Al surface. In this study, a wafer bonding technique for heterogeneous integration using electroplated Al bonding frame is demonstrated. The bonding mechanism relies on the mechanical deformation of the electroplated Al bonding frame through a localized bonding pressure by the groove structures on the counter wafer, i.e., press marking. The native oxide on the surface was removed and a fresh Al surface at the bonding interface was released through such a large mechanical deformation. The wafer bonding was demonstrated at the bonding temperatures of 250–450 ${}^{°}$C. The influence of the bonding temperature to the quality of the bonded substrates was investigated. The bonding shear strength of 8–100 MPa was obtained, which is comparable with the other Al bonding techniques requiring high bonding temperature. Full article

The expedient way for the development of microelectromechanical systems (MEMS) based devices are based on two key steps. First, perform the simulation for the optimization of various parameters by using different simulation tools that lead to cost reduction. Second, develop the devices with accurate fabrication steps using optimized parameters. Here, authors have performed a piezoelectric analysis of an array of zinc oxide (ZnO) nanostructures that have been created on both sides of aluminum sheets. Various quantities like swerve, stress, strain, electric flux, energy distribution, and electric potential have been studied during the piezo analysis. Then actual controlled growth of ZnO nanorods (NRs) arrays was done on both sides of the etched aluminum rod at low-temperature using the chemical bath deposition (CBD) method for the development of a MEMS energy harvester. Micro creaks on the substrate acted as an alternative to the seed layer. The testing was performed by applying ambient range force on the nanostructure. It was found that the voltage range on topside was 0.59 to 0.62 mV, and the bottom side was 0.52 to 0.55 mV. These kinds of devices are useful in low power micro-devices, nanoelectromechanical systems, and smart wearable systems. Full article

We present a numerical model for the recently introduced simple and inexpensive micromachined aluminum devices with a polydimethylsiloxane (PDMS) cover for microparticle acoustophoresis. We validate the model experimentally for a basic design, where a microchannel is milled into the surface of an aluminum substrate, sealed with a PDMS cover, and driven at MHz frequencies by a piezoelectric lead-zirconate-titanate (PZT) transducer. Both experimentally and numerically we find that the soft PDMS cover suppresses the Rayleigh streaming rolls in the bulk. However, due to the low transverse speed of sound in PDMS, such devices are prone to exhibit acoustic streaming vortices in the corners with a relatively large velocity. We predict numerically that in devices, where the microchannel is milled all the way through the aluminum substrate and sealed with a PDMS cover on both the top and bottom, the Rayleigh streaming is suppressed in the bulk thus enabling focusing of sub-micrometer-sized particles. Full article

Piezoelectric vibration energy harvesting (pVEH) microdevices can convert the mechanical vibrations to electrical voltages. In the future, these microdevices can provide an alternative to replace the electrochemical batteries, which cause contamination due to their toxic materials. We present the electromechanical modeling of a pVEH microdevice with a novel resonant structure for air conditioning vents at office buildings. This electromechanical modeling includes different multilayers and cross-sections of the microdevice resonator as well as the air damping. This microdevice uses a flexible substrate and it does not include toxics materials. The microdevice has a resonant structure formed by multilayer beams and U-shape proof mass of UV-resin (730 μm thickness). The multilayer beams contain flexible substrates (160 μm thickness) of polyethylene terephthalate (PET), two aluminum electrodes (100 nm thickness), and a ZnO layer (2 μm thickness). An analytical model is developed to predict the first bending resonant frequency and deflections of the microdevice. This model considers the Rayleigh and Macaulay methods, and the Euler-Bernoulli beam theory. In addition, the electromechanical behavior of the microdevice is determined through the finite element method (FEM) models. In these FEM models, the output power of the microdevice is obtained using different sinusoidal accelerations. The microdevice has a resonant frequency of 60.3 Hz, a maximum deflection of 2.485 mm considering an acceleration of 1.5 m/s², an output voltage of 2.854 V and generated power of 37.45 μW with a load resistance of 217.5 kΩ. An array of pVEH microdevices connected in series could be used to convert the displacements of air conditioning vents at office buildings into voltages for electronic devices and sensors. Full article

A new dual-mode liquid-crystal (LC) micro-device constructed by incorporating a Fabry–Perot (FP) cavity and an arrayed LC micro-lens for performing simultaneous electrically adjusted filtering and zooming in infrared wavelength range is presented in this paper. The main micro-structure is a micro-cavity consisting of two parallel zinc selenide (ZnSe) substrates that are pre-coated with ~20-nm aluminum (Al) layers which served as their high-reflection films and electrodes. In particular, the top electrode of the device is patterned by 44 × 38 circular micro-holes of 120 μm diameter, which also means a 44 × 38 micro-lens array. The micro-cavity with a typical depth of ~12 μm is fully filled by LC materials. The experimental results show that the spectral component with needed frequency or wavelength can be selected effectively from incident micro-beams, and both the transmission spectrum and the point spread function can be adjusted simultaneously by simply varying the root-mean-square value of the signal voltage applied, so as to demonstrate a closely correlated feature of filtering and zooming. In addition, the maximum transmittance is already up to ~20% according the peak-to-valley value of the spectral transmittance curves, which exhibits nearly twice the increment compared with that of the ordinary LC-FP filtering without micro-lenses. Full article