Search Results (35)

As semiconductor packaging technologies face limitations, through-silicon via (TSV) technology has emerged as a key solution to extending Moore’s law by achieving high-density, high-performance microelectronics. TSV technology enables enhanced wiring density, signal speed, and power efficiency, and offers significant advantages over traditional wire-bonding techniques. However, achieving fine-pitch and high-density interconnects remains a challenge. Solder flip-chip microbumps have demonstrated their potential to improve interconnect reliability and performance. However, the environmental impact of lead-based solders necessitates a shift to lead-free alternatives. This review highlights the transition from Sn-Pb solders to lead-free options, such as Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Zn, and Bi- or In-based alloys, driven by regulatory and environmental considerations. Although lead-free solders address environmental concerns, their higher melting points pose challenges such as thermal stress and chip warping, which affect device reliability. To overcome these challenges, the development of low-melting-point solder alloys has gained momentum. This study examines advancements in low-temperature solder technologies and evaluates their potential for enhancing device reliability by mitigating thermal stress and ensuring long-term stability. Full article

In the present study, our emphasis was directed towards the fabrication process of long multi-core superconducting wires, each spanning several hundred meters. These wires feature an in situ MgB₂ core, an ex situ MgB₂ barrier, and a copper shield. The cost-effectiveness of these constituent materials, coupled with a judicious arrangement of internal components, facilitates the utilization of an economical shielding material for the resulting wire. Our ongoing efforts have successfully yielded several hundred-meter-long wire sections possessing favorable superconducting characteristics, making them suitable for self-field applications, such as direct current (DC) power lines. Full article

The influence of heat treatment and deformation on the microstructure and properties of a Cu–Ni–Si alloy/AA8030 alloy composite wire was studied. After aging at 450 °C for 60 min, the composite wire exhibited relatively high comprehensive properties, with ultimate tensile strength, elongation, and electrical conductivity values of 253 MPa, 11.1%, and 55.3% IACS, respectively. Microstructural analysis revealed that precipitation and dislocation strengthening played important roles in the aged Cu–Ni–Si alloy cladding, whereas grain boundary and dislocation strengthening contributed to the strength of the AA8030 alloy. Then, the wire underwent five passes of drawing with a total deformation of 75%. Significant work hardening changed the ultimate tensile strength, elongation, and electrical conductivity of the composite wire to 422 MPa, 3.3%, and 53.6% IACS, respectively. CuAl₂, CuAl and Cu₉Al₄ layers were formed at the composite interface during aging. The CuAl₂ and Cu₉Al₄ layers grew toward the Al alloy and Cu alloy, respectively, whereas the CuAl layer grew toward both the Al alloy and the Cu alloy. Full article

Wire-arc additive manufacturing (WAAM) is widely applied in the aerospace, automotive, defense, and other industries. As such, the study of the formation and evolution mechanism of grains to achieve precise control over the performance of additive parts is important. In this study, AA2024 high-strength Al alloy wire was used to produce WAAM specimens under different heat inputs by varying different parameters. Subsequently, their microstructure, phases, and tensile properties were analyzed. The results indicated that the predominant crystal comprised cellular crystals, columnar crystals and dendritic crystals. At a heat input of 5500–6200 kJ m⁻¹, the internal morphology of the specimen, characterized by the significant presence of fine cellular crystals, was predominantly favorable. As the heat input increased, α (Al) and θ (CuAl₂) phases were increasingly identified within the specimens, the grid-like distribution of the θ phase along the crystal boundaries became clearer, and the θ′ phase precipitation decreased. Solution treatment and aging of the specimen produced using the optimal WAAM parameters resulted in an ultimate tensile strength (UTS) of 398 MPa, yield strength (YS) of 284 MPa, and elongation of 11.3%. The results should serve as a basis for selecting suitable WAAM process parameters. Full article

As electronic packaging technology advances towards miniaturization and integration, the issue of electromigration (EM) in lead-free solder joints has become a significant factor affecting solder joint reliability. In this study, a Sn-3.0Ag-0.5Cu (SAC305) alloy was used as the base, and different Bi content alloys, SAC305-xBi (x = 0, 0.5, 0.75, 1.0 wt.%), were prepared for tensile strength, hardness, and wetting tests. Copper wire was used to prepare EM test samples, which were subjected to EM tests at a current density of approximately 0.6 × 10⁴ A/cm² for varying durations. The interface microstructure of the SAC305-xBi alloys after the EM test was observed using an optical microscope. The results showed that the 0.5 wt.% Bi alloy exhibited the highest ultimate tensile strength and microhardness, improving by 33.3% and 11.8% compared to SAC305, respectively, with similar fracture strain. This alloy also displayed enhanced wettability. EM tests revealed the formation of Cu₆Sn₅ and Cu₃Sn intermetallic compounds (IMCs) at both the cathode and anode interfaces of the solder alloy. The addition of Bi inhibited the diffusion rate of Sn in Cu₆Sn₅, resulting in similar total IMC thickness at the anode interface across different Bi contents under the same test conditions. However, the total IMC thickness at the cathode interface decreased and stabilized with increasing EM time, with the SAC305-0.75Bi alloy demonstrating the best resistance to EM. Full article

This paper conducted a high-temperature storage test (HTST) on bonded samples made of Pd100 (Pd-coated Cu wire with a Pd layer thickness of 100 nm) and Pd120, and studied the growth law of Cu-Ag intermetallic compounds and the inhibitory mechanism of Pd thickness on Cu-Ag intermetallic compounds. The results show that the Kirkendall effect at the bonding interface of the Pd100-bonded sample is more obvious after the HTST, the sizes of voids and cracks are larger, and the thickness of intermetallic compounds is uneven. But, the bonding interface of the Pd120-bonded sample has almost no microcracks, the Kirkendall voids are small, and the intermetallic compound size is uniform and relatively thin. The formation sequence of intermetallic compounds is as follows: Cu atoms diffuse into the Ag layer to form Ag-rich compounds such as CuAg₄ or CuAg₂, and then the CuAg forms with the increase in diffused Cu elements. Pd can significantly reduce the Kirkendall effect and slow down the growth of Cu-Ag intermetallic compounds. The growth rate of intermetallic compounds is too fast when the Cu bonding wire has a thin Pd layer, which results in holes and microcracks in the bonding interface and lead to the peeling of the bonding interface. Voids and cracks will hinder the continuous diffusion of Cu and Ag atoms, resulting in the growth of intermetallic compounds being inhibited. Full article

In this paper, three Pd-coated Cu (PCC) wires with different Pd-layer thicknesses were used to make bonding samples, and the influence of Pd-layer thickness on the reliability of bonded points before and after a high-temperature storage test was studied. The results show that smaller bonding pressure and ultrasonic power lead to insufficient plastic deformation of the ball-bonded point, which also leads to small contact area with the pad and low bonding strength. Excessive bonding pressure and ultrasonic power will lead to ‘scratch’ on the surface of the pad and large-scale Ag spatter. The wedge-bonded point has a narrowed width when the bonding pressure and ultrasonic power are too small, and the tail edge will be cocked, resulting in false bonding and low strength. When the bonding pressure or ultrasonic power is too large, it will cause stress concentration, and the pad will appear as an ‘internal injury’, which will improve the failure probability; a high-temperature environment can make Cu-Ag intermetallic compounds (IMCs) grow and improve the bonding strength. With the extension of high-temperature storage time, the shear force of Pd100 gradually reaches the peak and then decreases, due to Kirkendall pores caused by excessive growth of IMCs, while the shear force of Pd120 continued to increase due to the slow growth rate of IMCs. In the high-temperature storage test, the thicker the Pd layer of the bonding wire, the higher the bonding strength; in the cold/hot cycle test, the sample with the largest Pd-layer thickness has the lowest failure rate. The thicker the Pd layer, the stronger its ability to resist changes in the external environment, and the higher its stability and reliability. Full article

Metal manufacturing processes based on deformation (forging, rolling) result in a fine grain structure with a complex dislocation substructure, which positively influence mechanical properties. Casting and additive manufacturing (powder- or wire-based) usually produce a coarse grain structure with a poorly developed dislocation substructure, which negatively affect mechanical properties. Heat treatment may alter phase balance and stimulate precipitation strengthening; however, precipitation kinetics depends on the dislocation substructure. In this paper, a comparative study of the microstructure and strength is presented for Monel K500 alloy containing 63 Ni, 30 Cu, 2.0 Mn, and 2.0 Fe (wt.%), and microalloyed with Al, Ti, and C hot-rolled to a round bar and deposited on a round surface using wire additive manufacturing (WAAM) technology. An increased dislocation density and number density of fine precipitates resulted in 8–25% higher hardness and 1.8–2.6 times higher compression yield stress in the hot-rolled alloy compared to these in the WAAM-produced alloy. However, due to a high work hardening rate, only 3–10% cold deformation was necessary to increase the strength of the WAAM alloy to this of the hot-rolled one. Age hardening heat treatment, through the intensification of the precipitation strengthening mechanism, reduced the value of cold deformation strain required to equalise the properties. Based on the obtained results, a new technology consisting of additive manufacturing, heat treatment, and cold deformation can be proposed. It can produce WAAM components with strength and hardness improved to the level of hot-rolled components, which is a significant development of additive manufacturing. Full article

High-strength, high-conductivity copper/silver-alloyed materials were prepared by cold-spray (CS) manufacturing. For DC high-field application at room temperature, bulk Cu/Ag (5% vol. Ag) alloys with high mechanical properties and high electrical conductivity can be obtained by CS and post-heat treatments. For pulsed-field application at liquid nitrogen temperature, bulk Cu/Ag (5% vol. Ag) alloys serve as precursors for room-temperature wire drawing. The Cu/Ag-alloyed bulk CS deposit presents a high yield strength of about 510 MPa with a corresponding electrical resistivity of 1.92 µΩ·cm (at 293 K). The Cu/Ag-alloyed wires show a very high ultimate tensile strength (1660 MPa at 77 K or 1370 MPa at 293 K) and low electrical resistivity (1.05 µΩ·cm at 77 K or 2.56 µΩ·cm at 293 K). Microstructural studies via STEM allow us to understand this very high level of mechanical strength. The results evidence that materials developed by CS exhibit very high mechanical properties compared to materials prepared by other routes, due to the high velocity of the deposited particles, which leads to high initial deformation rates and specific microstructural features. Full article

Wire bonding, one of the methods for electrically connecting a semiconductor chip with a substrate, involves attaching thin metal wires to pads. It is the oldest electrical connection method that exhibits high compatibility with other processes. The metal wires used for electrical connection in wire bonding are mainly made of Au, Cu, and Ag. After the wire bonding, molding is performed using the epoxy molding compound (EMC). However, EMC inevitably contains ions such as halogen elements. In addition, it absorbs moisture due to its hydrophilicity, creating a corrosive environment with electrolytes. In this study, we evaluated the influence of hydrochloric acid concentration on corrosion behavior between Au or Cu bonding wires and sputtered Al bond pads. The electrochemical factors such as corrosion potential difference (ΔE), galvanic corrosion current density (i_g), and anodic and cathodic Tafel slopes were found to influence galvanic corrosion behavior. Galvanic corrosion tendency in first bond and second bond areas of PCB unit specimen was confirmed. Full article

Magnetic fluids, a new type of energy transfer fluid with tunable properties, have garnered significant interest from researchers worldwide. Hybrid magnetic fluids prepared by adding different types of nanoparticles exhibit superior thermophysical properties and functional characteristics. In this paper, we prepared a water-based magnetic fluid loaded with multi-walled carbon nanotubes (MCNTs), silver (Ag), and copper (Cu) to enhance thermal conductivity. Using a transient double hot-wire method, we designed and built an experimental measurement system for the thermal conductivity of magnetic fluids with an average measurement error of less than 5%. We studied the thermal conductivity of hybrid magnetic fluids under different conditions and evaluated the advantages and disadvantages of various models, including the Maxwell model, H&C model, Tim model, Y&C model, and Evans model. Our results show that MF+MCNTs, MF+Ag, and MF+Cu nanofluids can all improve the thermal conductivity of the carrier fluid, with MF+MCNTs exhibiting the best improvement effect of 10.93%. Among the five models evaluated, the Evans model had the best predictive effect with a deviation range within 5%. This work provides theoretical and practical reference for enhancing the thermal conductivity of magnetic fluids and provides a more accurate theoretical model for calculating the thermal conductivity of hybrid magnetic fluids. Full article

The effects of various drawing parameters and annealing processes on the structure and properties of Cu-Ag wires, containing 1 wt% silver, were investigated using specialized equipment including fine wire-drawing machines, very fine wire-drawing machines, heat treatment equipment, tensile testing machines, microcomputer-controlled electronic universal testers, resistance testers, and scanning electron microscopes. The results revealed that continuous drawing of Cu-1%Ag alloy wires led to elongation of the grains, resulting in a uniform and tightly fibrous microstructure. Moreover, the tensile strength of the alloy wire increased from 670 MPa to 783.9 MPa after a single pass with a deformation of 14%. Subsequently, when the wire was drawn at a speed of 500 m/min, the tensile strength further increased to 820.1 MPa. After annealing the Փ0.08 mm Cu-1% Ag alloy wire, an increase in annealing temperature up to 500 °C resulted in the wire’s tensile strength decreasing from 820.1 MPa to 377.5 MPa. Simultaneously, the elongation increased from 1.94% to 15.21%, and the resistivity decreased from 1.931 × 10⁻⁸ Ω·m to 1.723 × 10⁻⁸ Ω·m. Additionally, when annealing was conducted at a rate of 80 m/min, the wire resistivity dropped to 1.635 × 10⁻⁸ Ω·m. Full article

Bond properties were performed on Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu alloy wire with a diameter of 25 µm under different process parameters. The effects of electrical flaming off (EFO) current and EFO time on the deformability of the free air ball (FAB) were investigated using scanning electron microscopy (SEM), as well as the effects of ultrasonic power and bonding force on the bond characteristic. The experimental results show that FAB grows from a preheated tip to a small ball, a regular ball, and finally to a golf ball with increasing either the EFO current or the EFO time, and the FAB presents an optimal shape at 25 mA and 650 μs. Moreover, a nonlinear relationship between FAB diameter and EFO time is obtained at an EFO current of 25 mA, which could be expressed by a cubic equation. Further, at a constant bonding force, as the ultrasonic power increased, the mashed ball diameter grew larger and larger, the capillary hole imprint became more and more obvious, and the tail width also increased, and vice versa. The optimal ultrasonic power and bonding force are 70 mW and 45 gf for ball bonding and 90 mW and 75 gf for wedge bonding, respectively. Finally, for all the bonded wire samples prepared under optimal process parameters, no ball and wedge bond lifts happened after the destructive pull test, and full intermetallic compound coverage with perfect morphology occurred on the bond pad after the ball shear test, which meant that the bonded wire samples had high bond strength and hence improved the reliability of microelectronic products. It provided technical support for the reliability research of Pt-containing Ag-based bonding alloy wires. Full article

In situ NMR spectroelectrochemistry is extremely powerful in studying redox reactions in real time and identifying unstable reaction intermediates. In this paper, in situ polymerization synthesis of ultrathin graphdiyne (GDY) nanosheets was realized on the surface of copper nanoflower/copper foam (nano−Cu/Cuf)-based electrode with hexakisbenzene monomers and pyridine. Palladium (Pd) nanoparticles were further deposited onto the GDY nanosheets by the constant potential method. By using this GDY composite as electrode material, a new NMR-electrochemical cell was designed for in situ NMR spectroelectrochemistry measurement. The three-electrode electrochemical system consists of a Pd/GDY/nano−Cu/Cuf electrode as the working electrode, a platinum wire as the counter electrode, and a silver/silver chloride (Ag/AgCl) wire as a quasi-reference electrode, which can be dipped into a specially constructed sample tube and adapted for convenient operation in any commercial high-field, variable-temperature FT NMR spectrometer. The application of this NMR-electrochemical cell is illustrated by monitoring the progressive oxidation of hydroquinone to benzoquinone by controlled-potential electrolysis in aqueous solution. Full article

Al-Cu alloy has broad application prospects in the field of aerospace due to its excellent performance. In this paper, deposits with different Cu contents were prepared by the wire arc additive manufacturing (WAAM) process, and the effects of Cu content on the microstructure and mechanical properties were investigated. The microstructure of Al-Cu alloy was investigated by metallography, scanning electron microscope (SEM), energy-dispersive spectrometer (EDS), and transmission electron microscope (TEM). The results show that both the number and size of the precipitated θ phases (Al₂Cu) in the as-deposited material increase with the increase of Cu content. After the T4 treatment, the solid solution amount of Cu in the matrix showed a trend of first increasing and then remaining stable. When the content of Cu was greater than 5.65%, as the Cu content increased, the number and size of the remaining θ phases both increased. In the peak ageing state, the amount of precipitated θ’ phase showed a trend of increasing and then remaining stable. After the T6 treatment, the mechanical properties showed a trend of first increasing and then decreasing with the increase of the content of Cu. When the Cu content was 5.65%, the deposit achieved the best mechanical properties, and the anisotropy of the mechanical properties disappeared. The tensile strength, yield strength, and elongation reached 538 MPa, 478 MPa, and 10.5%, respectively. When the content of Cu was greater than 5.65%, the anisotropy of mechanical properties was obvious, and the fracture mode of the vertical specimen changed from ductile fracture to brittle fracture. Full article