Thermodynamic Modeling and Analysis of Thermoelectric Cooling Systems
A special issue of Thermo (ISSN 2673-7264).
Deadline for manuscript submissions: 30 June 2026 | Viewed by 54
Special Issue Editor
Interests: energy harvesting intelligent chip; self-powered thermal management chip; energy acquisition and power management; electronic packaging thermal management; thermoelectric energy harvesting and conversion
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Thermoelectric cooling systems have been garnering attention lately—boasting high efficiency, energy savings, reduced noise, and a compact footprint, they are unlocking exciting prospects in electronic device thermal management and new energy utilization. As self-powered technologies and smart chip design evolve at breakneck speed, optimizing these systems’ thermodynamic characteristics and refining modeling analysis have quietly become core research focuses.
This Special Issue homes in on thermodynamic modeling methods, energy conversion mechanisms, and thermal management optimization strategies—with special attention paid to cutting-edge innovations like energy harvesting smart chips and self-powered thermal management chips. Simply put, we aim to gather global scholars’ latest achievements, explore the practical application of thermodynamic theories, boost technological breakthroughs and industrial transformation, and offer a communication hub for researchers and engineers in related fields.
Potential topics/sub-themes may include the following:
- Thermodynamic modeling and simulation of thermoelectric cooling systems (including transient/steady-state performance analysis).
- Energy conversion mechanisms and efficiency optimization of thermoelectric devices for self-powered thermal management.
- Thermal management strategies for electronic packaging integrated with thermoelectric cooling modules.
- Multi-physics coupling (heat–electricity) modeling of micro-scale thermoelectric cooling systems for chip-level heat dissipation.
- Entropy generation analysis and thermodynamic irreversibility reduction in thermoelectric cooling processes.
You may choose our Joint Special Issue in Entropy.
Prof. Dr. Ning Wang
Guest Editor
Manuscript Submission Information
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Keywords
- thermoelectric cooling systems
- thermodynamic modeling
- thermal management optimization
- energy conversion
- self-powered technology
- smart chips
- electronic device thermal management
- technological innovation
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