Advances and Innovations in Deep Learning: Unveiling Multidisciplinary Applications and Challenges
A special issue of Inventions (ISSN 2411-5134). This special issue belongs to the section "Inventions and Innovation in Design, Modeling and Computing Methods".
Deadline for manuscript submissions: 20 August 2025 | Viewed by 819
Special Issue Editors
Interests: big data analysis; artificial intelligence and deep learning; intelligent protection of ancient books; multimodal learning
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The rapid evolution of artificial intelligence (AI) and deep learning has redefined the boundaries of technological innovation. This Special Issue welcomes submissions that traverse a wide spectrum of interdisciplinary research, exploring novel algorithms and architectures that could enhance the performance and efficiency of AI systems. This might involve advancements in neural network design, optimization techniques, or the development of hybrid models. Additionally, the application of AI in various sectors holds great promise. For instance, in healthcare, it can assist in disease diagnosis and treatment planning; in transportation, it enables autonomous driving and traffic optimization; and in finance, it aids in risk assessment and fraud detection. We also encourage investigations into the ethical and social implications of AI, as well as the challenges related to data privacy and security. All high-quality contributions that push the boundaries of this field are welcome, including research on the development of explainable AI models, the utilization of AI in emerging technologies such as the Internet of Things and blockchain, and the exploration of AI’s potential in creative fields such as art and music generation.
This Special Issue focuses on the recent and significant progress made in artificial intelligence and deep learning. It aims to bring together research that showcases the practical applications and theoretical advancements of these technologies. The scope includes, but is not limited to, the following:
- Artificial intelligence;
- Deep learning;
- Large models;
- Language processing;
- Image processing;
- Remote sensing;
- AI security;
- Intelligent systems;
- Data analysis;
- AI applications and inventions.
Prof. Dr. Yu Weng
Dr. Zheng Liu
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Inventions is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- artificial intelligence
- deep learning
- large models
- language processing
- image processing
- remote sensing
- ai security
- intelligent systems
- data analysis
- AI applications and inventions
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