Gao, M.; Lei, D.; Zhang, Y.; Ye, H.; Zhang, Y.; Zeng, C.; Hu, T.; Jiang, H.; Lu, Q.; Yang, Y.;
et al. Verification of Design and Process for Optimal Large-Area Substrate Eutectic Bonding in SiP Packaging. Solids 2026, 7, 18.
https://doi.org/10.3390/solids7020018
AMA Style
Gao M, Lei D, Zhang Y, Ye H, Zhang Y, Zeng C, Hu T, Jiang H, Lu Q, Yang Y,
et al. Verification of Design and Process for Optimal Large-Area Substrate Eutectic Bonding in SiP Packaging. Solids. 2026; 7(2):18.
https://doi.org/10.3390/solids7020018
Chicago/Turabian Style
Gao, Mingqi, Dongyang Lei, Yagang Zhang, Huijie Ye, Yanming Zhang, Ce Zeng, Tong Hu, Hai Jiang, Qian Lu, Yueyou Yang,
and et al. 2026. "Verification of Design and Process for Optimal Large-Area Substrate Eutectic Bonding in SiP Packaging" Solids 7, no. 2: 18.
https://doi.org/10.3390/solids7020018
APA Style
Gao, M., Lei, D., Zhang, Y., Ye, H., Zhang, Y., Zeng, C., Hu, T., Jiang, H., Lu, Q., Yang, Y., & Zhang, A.
(2026). Verification of Design and Process for Optimal Large-Area Substrate Eutectic Bonding in SiP Packaging. Solids, 7(2), 18.
https://doi.org/10.3390/solids7020018
