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Engineering Proceedings
Volume 38
Issue 1
10.3390/engproc2023038088
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Editorial

Preface of 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023 (IEEE ICEIB 2023) †

by
Teen-Hang Meen
1,*,
Hsin-Hung Lin
2 and
Cheng-Fu Yang
3,4,*
1
Department of Electronic Engineering, National Formosa University, Yunlin 632, Taiwan
2
Department of Creative Product Design, Asia University, Taichung 413, Taiwan
3
Department of Chemical and Materials Engineering, National University of Kaohsiung, Kaohsiung 811, Taiwan
4
Department of Aeronautical Engineering, Chaoyang University of Technology, Taichung 413, Taiwan
*
Authors to whom correspondence should be addressed.
†
All proceeding papers published in the volumes are presented at the 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data Conference 2023, Taichung, Taiwan, 14–16 April 2023.
Eng. Proc. 2023, 38(1), 88; https://doi.org/10.3390/engproc2023038088
Published: 27 July 2023
(This article belongs to the Proceedings of The 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023)
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This volume represents the proceedings of the 3rd IEEE International Conference on Electronic Communications, Internet of Things, and Big Data 2023 (IEEE ICEIB 2023) [...]

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MDPI and ACS Style

Meen, T.-H.; Lin, H.-H.; Yang, C.-F. Preface of 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023 (IEEE ICEIB 2023). Eng. Proc. 2023, 38, 88. https://doi.org/10.3390/engproc2023038088

AMA Style

Meen T-H, Lin H-H, Yang C-F. Preface of 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023 (IEEE ICEIB 2023). Engineering Proceedings. 2023; 38(1):88. https://doi.org/10.3390/engproc2023038088

Chicago/Turabian Style

Meen, Teen-Hang, Hsin-Hung Lin, and Cheng-Fu Yang. 2023. "Preface of 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023 (IEEE ICEIB 2023)" Engineering Proceedings 38, no. 1: 88. https://doi.org/10.3390/engproc2023038088

APA Style

Meen, T.-H., Lin, H.-H., & Yang, C.-F. (2023). Preface of 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023 (IEEE ICEIB 2023). Engineering Proceedings, 38(1), 88. https://doi.org/10.3390/engproc2023038088

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