Design Considerations for Low-Temperature Plasma Production in Air Using Pulsed Dielectric Barrier Discharges: A Review
Abstract
1. Introduction
2. Design Considerations for Pulsed DBDs in Air
2.1. Streamer Dynamics
| Observation | Refs. |
|---|---|
| An increase in pulse rise rate increases discharge current, streamer velocity and diameter. | [56] |
| A decrease in the air gap decreased the streamer diameter (volume DBD). | [57] |
| Higher streamer velocity, diameter and current observed for positive pulses. | [49] |
| The electrical field magnitude and streamer diameter influence radical yield. | [52] |
| Streamer length is independent of dd, decreases with increasing εr (surface DBD). | [58] |
| Streamer velocity increases when εr increases (needle-plate DBD). | [59] |
| A shorter gap length reduces the streamer duration. | [52] |
| The length of the secondary streamer increases linearly with applied voltage (volume DBD). | [29] |
| A positive streamer has a lower onset voltage and a higher velocity. | [60] |
| The primary streamer length and velocity decreased by increasing the PRF (surface DBD). | [61] |
| Primary streamer velocity and diameter increase by increasing the electric field in the gap (Eg). | [62] |
2.2. Charge Trapping in and on Barriers
2.3. Electrode and Barrier Degradation
| Degraded Material | Observed Effect |
|---|---|
| FR-4 (epoxy/fiberglass) | Whitening, increased hydrophilicity [94], epoxy erosion [95] |
| PVC | Increased hydrophilicity [91], discoloration [96] |
| PMMA (acrylate) | Cavities, increased roughness, powder particle formation [96] |
| Polyimide (Kapton) | Erosion [95], structural change polymer chain, whitening, etching [99], hole formation [97], roughening [98] |
| Polypropylene (PP) | Breakdown, structural change polymer chain, whitening [99] |
| PTFE (Teflon) | Charging [76] |
| Silicone rubber | Erosion [100] |
| Silicon nanowires | Fracturing of nanowires [101] |
| Natural quartz | Microsoftening, decreased hydrophilicity [102] |
| Silver/Platinum | Oxidation, deformation [106] |
| Silver/Palladium | Oxidation, deformation [106], erosion, blackening [107] |
| Silver | Erosion [97], blackening [100] |
| Gold (photolytic deposited) | Erosion, melting [109] |
| Aluminium | Oxidation, microcraters [108] |
| Copper | Erosion [103], oxidation [108], blackening [106] |
| Copper with Ni/Au coating | Rough edges, holes [94] |
| Tungsten | Oxidation [111,112], erosion [103] |
| Nickel | Erosion, melting [92] |
| Stainless steel | Release of particles [93], oxidation [111], erosion [112] |
2.4. Heat Production and Dielectric Loss Factor
2.5. Relative Permittivity (εr), DBD Capacitance (Ccell), Dielectric Thickness (dd) and Electrode Length (le)
2.6. Electric Field Strength (Eg) Enhancement
2.7. Electrode Width (we) and Gap Distance (dg)
2.8. Ozone Production and Decomposition
2.8.1. Formation, Decomposition and Transport of Ozone
2.8.2. Influence of Pulse Rise Time on Ozone Production
2.8.3. Ozone Yield
2.9. DBD—Pulse Source Interaction
3. Summary & Outlook
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
Abbreviations
| LTP | Low-temperature atmospheric plasma |
| RONS | Reactive oxygen and nitrogen species |
| ε0 | Vacuum permittivity |
| εr | Relative permittivity |
| we | Electrode width |
| dg | Gap distance |
| dd | Dielectric barrier thickness |
| le | Electrode length |
| Ccell | DBD capacitance |
| Cd | Dielectric barrier capacitance |
| Cg | Air gap capacitance |
| Ug | Voltage over the air gap |
| Ud | Voltage over the dielectric barrier |
| Rg | Variable resistance of the air gap |
| trise | Rise time of voltage pulse |
| tfall | Fall time of voltage pulse |
| trise,source | Rise time of the pulse source without load |
| Eg | Electric field strength in the air gap |
| Ed | Electric field strength in the dielectric barrier |
| dE/dt | Change of electric field strength over time |
| N | Number density of neutral particles |
| E/N | Reduced electric field |
| Tgas | Gas temperature |
| Tvib | Vibrational temperature |
| Trot | Rotational temperature |
| Te | Electron energy (electron temperature) |
| ne | Electron density |
| µe | Electron mobility |
| V | Applied (peak) voltage |
| V-I | Voltage-current |
| Vbr | Breakdown (ignition) voltage |
| Icond | Conduction current |
| Idisp | Displacement current |
| Q | Charge per pulse |
| Ep | Energy per pulse |
| P | Discharge power |
| PRF | Pulse repetition frequency |
| C | Ozone concentration |
| ηO3 | Ozone yield |
| SIE | Specific input energy |
| Qs | Standardized air flow |
| AC | Alternating current |
| tan (δ) | Tangential loss factor |
| dlf | Dielectric loss factor |
| PMT | Photomultiplier tube |
| OES | Optical emission spectroscopy |
| EFISH | Electric field-induced second harmonic |
| SHG | Second harmonics |
| IMG | Impedance-matched Marx generator |
| τr | Ion recombination time |
| τd | Space charge diffusion time on dielectric surface |
| τs | Surface charge relaxation time |
| ρv | Material volume resistivity |
| Anode | Electrode with positive voltage applied |
| Cathode | Grounded electrode |
| PFAS | Per- and polyfluoroalkyl substances |
| PTFE | Polytetrafluorethyleen (Teflon) |
| PI | Polyimide (Kapton) |
| PP | Polypropylene |
| PMMA | Polymethylmethacrylate (Plexiglas) |
| PVC | Polyvinylchloride |
| PEEK | Polyether ether ketone |
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| Material | tan (δ) | εr | dlf | Refs. |
|---|---|---|---|---|
| Quartz | 1 × 10−3–1 × 10−4 | 3.8–4 | 3.7 × 10−3–3.7 × 10−4 | [126,127] |
| Alumina | 1 × 10−2–1 × 10−3 | 9.6–9.7 | 9.5 × 10−3–9.8 × 10−2 | [104,126] |
| Borosilicate glass | 1 × 10−3–1 × 10−4 | 4.6–7 | 4 × 10−4–5 × 10−3 | [126,128] |
| εr ↑ | dd ↓ | le ↑ * | we ↓ | dg↓ | |
|---|---|---|---|---|---|
| Eg | ↑ | ↑ | - | ↑ | ↑ |
| Ed | ↓ | ↑ | - | ↑ | ↓ |
| Vbr | ↓ ** | ↓ | - | ↓ | ↓ |
| dlf | ↑ | - | - | - | - |
| Barrier heating | ↑ | ↑ | ↓ | ↑ | ↑ |
| Ccell | ↑ | ↑ | ↑ | ↓ | ↑ |
| trise, tfall | ↑ | ↑ | ↑ | ↓ | ↑ |
| dE/dt | ↓ | ↓ | ↓ | ↑ | ↓ |
| Icond, ne,Te | ↑ *** | ↑ *** | ↑ *** | ↑ | ↑ *** |
| RONS | ↑ | ↑ | ↑ | ↑ | ↑ |
| Q, Ep | ↑ **** | ↑ | ↑ | ↓ | ↑ |
| ηO3 | ↑ | ↑ | - | ↑ | ↑ |
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Wymenga, L.F.A.; van Turnhout, J.; Ghaffarian Niasar, M.; van Zeijl, H.; van Driel, W.D.; Zhang, G. Design Considerations for Low-Temperature Plasma Production in Air Using Pulsed Dielectric Barrier Discharges: A Review. Plasma 2026, 9, 15. https://doi.org/10.3390/plasma9020015
Wymenga LFA, van Turnhout J, Ghaffarian Niasar M, van Zeijl H, van Driel WD, Zhang G. Design Considerations for Low-Temperature Plasma Production in Air Using Pulsed Dielectric Barrier Discharges: A Review. Plasma. 2026; 9(2):15. https://doi.org/10.3390/plasma9020015
Chicago/Turabian StyleWymenga, Luutzen Franciscus Ate, Jan van Turnhout, Mohamad Ghaffarian Niasar, Henk van Zeijl, Willem Dirk van Driel, and Guoqi Zhang. 2026. "Design Considerations for Low-Temperature Plasma Production in Air Using Pulsed Dielectric Barrier Discharges: A Review" Plasma 9, no. 2: 15. https://doi.org/10.3390/plasma9020015
APA StyleWymenga, L. F. A., van Turnhout, J., Ghaffarian Niasar, M., van Zeijl, H., van Driel, W. D., & Zhang, G. (2026). Design Considerations for Low-Temperature Plasma Production in Air Using Pulsed Dielectric Barrier Discharges: A Review. Plasma, 9(2), 15. https://doi.org/10.3390/plasma9020015

