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Proceedings

Sensors for Thermal Characterization of Solid and Liquid Samples by 3-Omega Method

1
VTT Technical Research Centre of Finland Ltd., Espoo, P.O. Box 1000, 02044 VTT, Finland
2
Berliner Nanotest und Design GmbH, 12489 Berlin, Germany
3
Technische Universität Chemnitz, 09111 Chemnitz, Germany
*
Author to whom correspondence should be addressed.
Presented at the Eurosensors 2018 Conference, Graz, Austria, 9–12 September 2018.
Proceedings 2018, 2(13), 883; https://doi.org/10.3390/proceedings2130883
Published: 28 November 2018
(This article belongs to the Proceedings of EUROSENSORS 2018)
Microchips have been designed and fabricated for the fast thermal characterization of samples by extension of the 3-omega method. Both solid and liquid samples can be measured by applying a small amount of material under investigation on the chip containing a micro heater/sensor. Two types of chips have been fabricated and tested: silicon chips with porous silicon (PS) layer as thermal isolator and glass chips with through glass vias (TGVs) for the back side contacting of the top side heater/sensor.
Keywords: thermal conductivity; 3-omega method; porous silicon; glass; microfabrication; atomic layer deposition thermal conductivity; 3-omega method; porous silicon; glass; microfabrication; atomic layer deposition
MDPI and ACS Style

Grigoras, K.; Varpula, A.; Grosse, C.; May, D.; Ras, M.A.; Prunnila, M. Sensors for Thermal Characterization of Solid and Liquid Samples by 3-Omega Method. Proceedings 2018, 2, 883. https://doi.org/10.3390/proceedings2130883

AMA Style

Grigoras K, Varpula A, Grosse C, May D, Ras MA, Prunnila M. Sensors for Thermal Characterization of Solid and Liquid Samples by 3-Omega Method. Proceedings. 2018; 2(13):883. https://doi.org/10.3390/proceedings2130883

Chicago/Turabian Style

Grigoras, Kestutis; Varpula, Aapo; Grosse, Corinna; May, Daniel; Ras, Mohamad Abo; Prunnila, Mika. 2018. "Sensors for Thermal Characterization of Solid and Liquid Samples by 3-Omega Method" Proceedings 2, no. 13: 883. https://doi.org/10.3390/proceedings2130883

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