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Proceedings

3DInkPack—Inkjet Printing of Discrete Sensor Packages for Advanced Rapid Prototyping

CTR Carinthian Tech Research AG, Europastrasse 12, A-9524 Villach, Austria
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Presented at the Eurosensors 2017 Conference, Paris, France, 3–6 September 2017.
Proceedings 2017, 1(4), 609; https://doi.org/10.3390/proceedings1040609
Published: 29 August 2017
(This article belongs to the Proceedings of Proceedings of Eurosensors 2017, Paris, France, 3–6 September 2017)
A rapid advanced packaging concept, consisting of inkjet photopolymer printing and Ag nanoparticles printing, was investigated for the construction of a pressure sensor package. Acrylate-type 3D package housing with 7 through-holes was printed with a polyjet printer and the through-vias and connection pads were manufactured via Ag glue dispensing and inkjet printing of Ag nanoparticle ink. The flip-chip packaging concept was pursued for the electrical connection between the package and the pressure sensor dye.
Keywords: rapid advanced prototyping; inkjet printing; sensor packaging rapid advanced prototyping; inkjet printing; sensor packaging
MDPI and ACS Style

Krivec, M.; Roshanghias, A.; Binder, A. 3DInkPack—Inkjet Printing of Discrete Sensor Packages for Advanced Rapid Prototyping. Proceedings 2017, 1, 609. https://doi.org/10.3390/proceedings1040609

AMA Style

Krivec M, Roshanghias A, Binder A. 3DInkPack—Inkjet Printing of Discrete Sensor Packages for Advanced Rapid Prototyping. Proceedings. 2017; 1(4):609. https://doi.org/10.3390/proceedings1040609

Chicago/Turabian Style

Krivec, Matic; Roshanghias, Ali; Binder, Alfred. 2017. "3DInkPack—Inkjet Printing of Discrete Sensor Packages for Advanced Rapid Prototyping" Proceedings 1, no. 4: 609. https://doi.org/10.3390/proceedings1040609

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