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Journal: Proceedings, 2017
Volume: 1
Number: 607

Article: Hermetic Cavities Using Gold Wafer Level Thermocompression Bonding
Authors: by Samuel Charlot, Patrick Pons, Monique Dilhan, Isabelle Vallet and Sebastiano Brida
Link: https://www.mdpi.com/2504-3900/1/4/607

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