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Journal: Fractal Fract., 2022
Volume: 6
Number: 705
Article:
Thermal Performance and Geometric Optimization of Fractal T-Shaped Highly-Conductive Material for Cooling of a Rectangular Chip
Authors:
by
Rongsheng Zhu and Dalei Jing
Link:
https://www.mdpi.com/2504-3110/6/12/705
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