Eßl, W.; Reiss, G.; Raninger, P.; Ecker, W.; Körbler, N.; Gerold, E.; Antrekowitsch, H.; Klocek, J.; Krivec, T.
Numerical Analysis of Convective Mass Transfer during Multi-Droplet Impingement on a Structured Surface in the Presence of an Adhered Liquid Film—An Application to Spray Etching of PCBs. Fluids 2023, 8, 180.
https://doi.org/10.3390/fluids8060180
AMA Style
Eßl W, Reiss G, Raninger P, Ecker W, Körbler N, Gerold E, Antrekowitsch H, Klocek J, Krivec T.
Numerical Analysis of Convective Mass Transfer during Multi-Droplet Impingement on a Structured Surface in the Presence of an Adhered Liquid Film—An Application to Spray Etching of PCBs. Fluids. 2023; 8(6):180.
https://doi.org/10.3390/fluids8060180
Chicago/Turabian Style
Eßl, Werner, Georg Reiss, Peter Raninger, Werner Ecker, Nadine Körbler, Eva Gerold, Helmut Antrekowitsch, Jolanta Klocek, and Thomas Krivec.
2023. "Numerical Analysis of Convective Mass Transfer during Multi-Droplet Impingement on a Structured Surface in the Presence of an Adhered Liquid Film—An Application to Spray Etching of PCBs" Fluids 8, no. 6: 180.
https://doi.org/10.3390/fluids8060180
APA Style
Eßl, W., Reiss, G., Raninger, P., Ecker, W., Körbler, N., Gerold, E., Antrekowitsch, H., Klocek, J., & Krivec, T.
(2023). Numerical Analysis of Convective Mass Transfer during Multi-Droplet Impingement on a Structured Surface in the Presence of an Adhered Liquid Film—An Application to Spray Etching of PCBs. Fluids, 8(6), 180.
https://doi.org/10.3390/fluids8060180
