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Journal: Photonics, 2023
Volume: 10
Number: 1348
1348
Article: RF Interconnection Design of Bump Bonding with a Dislocation Package Structure towards Electro-Optic Modulation Applications
Authors: by Jiahao Peng, Xiaofeng Wang, Libo Wang, Yang Li, Runhao Liu, Shiyao Deng, Heyuan Guan and Huihui Lu
Link: https://www.mdpi.com/2304-6732/10/12/1348

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