Cai, B.; Deng, W.; Wu, T.; Wang, T.; Ma, Z.; Liu, W.; Ma, L.; Liu, Z.
Experimental Study of a Loop Heat Pipe with Direct Pouring Porous Wick for Cooling Electronics. Processes 2021, 9, 1332.
https://doi.org/10.3390/pr9081332
AMA Style
Cai B, Deng W, Wu T, Wang T, Ma Z, Liu W, Ma L, Liu Z.
Experimental Study of a Loop Heat Pipe with Direct Pouring Porous Wick for Cooling Electronics. Processes. 2021; 9(8):1332.
https://doi.org/10.3390/pr9081332
Chicago/Turabian Style
Cai, Bing, Weizhong Deng, Tong Wu, Tingting Wang, Zhengyuan Ma, Wei Liu, Lei Ma, and Zhichun Liu.
2021. "Experimental Study of a Loop Heat Pipe with Direct Pouring Porous Wick for Cooling Electronics" Processes 9, no. 8: 1332.
https://doi.org/10.3390/pr9081332
APA Style
Cai, B., Deng, W., Wu, T., Wang, T., Ma, Z., Liu, W., Ma, L., & Liu, Z.
(2021). Experimental Study of a Loop Heat Pipe with Direct Pouring Porous Wick for Cooling Electronics. Processes, 9(8), 1332.
https://doi.org/10.3390/pr9081332