Fu, Y.; Cheng, Y.; Gong, P.; Cao, S.; Song, D.; He, G.
Numerical Simulation of Icing on UHV DC Ground Wires Under the Coupled Effect of Flow Field and Electric Field. Processes 2026, 14, 1757.
https://doi.org/10.3390/pr14111757
AMA Style
Fu Y, Cheng Y, Gong P, Cao S, Song D, He G.
Numerical Simulation of Icing on UHV DC Ground Wires Under the Coupled Effect of Flow Field and Electric Field. Processes. 2026; 14(11):1757.
https://doi.org/10.3390/pr14111757
Chicago/Turabian Style
Fu, Yufei, Yang Cheng, Peilin Gong, Songyuan Cao, Dongbo Song, and Gaohui He.
2026. "Numerical Simulation of Icing on UHV DC Ground Wires Under the Coupled Effect of Flow Field and Electric Field" Processes 14, no. 11: 1757.
https://doi.org/10.3390/pr14111757
APA Style
Fu, Y., Cheng, Y., Gong, P., Cao, S., Song, D., & He, G.
(2026). Numerical Simulation of Icing on UHV DC Ground Wires Under the Coupled Effect of Flow Field and Electric Field. Processes, 14(11), 1757.
https://doi.org/10.3390/pr14111757