Origin of Steam Contaminants and Degradation of Solid-Oxide Electrolysis Stacks
Round 1
Reviewer 1 Report
Very important for the SOC-community.
Author Response
Dear Reviewer,
thank you for your positive assessment of our publication draft.
We performed a final spellcheck and MDPI will provide final checks as well.
Best regards,
Dominik Schäfer
Reviewer 2 Report
Two “once-through steam generators” and a “combination of a steam generator and a gas preheater” for supplying feed gases to “solid-oxide electrolysis stacks” were evaluated for their carryover characteristics of contaminants from the feed-water into the steam phase. The concentrations of various trace impurities (i.e., As, Bi, Co, Cr, Cu, Fe, Mn, Mo, Ni, Sb, W, Zn, As, Bi, Al, B, Ba, Ca, K, Mg, Na, Si etc.) in the steam were determined by sampling the steam condensates. The post-test chemical analysis of cell samples revealed significant concentrations of silicon in the samples. The authors regarded Si as primary cause for cell degradation and they attributed the performance degradation during electrolysis to the silicon contamination in the feed gases. The study results are interesting and are valuable. It can be published with small corrections
Corrections
[1] line 27-- “….. a system-supporting operation of an SOC stack….” What is “SOC”?
[2] line 148--- “…. with a commercial SOFC/SOEC test…..” What is “SOFC/SOEC”?
Author Response
Dear Reviewer,
thank you for your positive assessment of our publication draft.
We exchanged "SOC cells" by "solid-oxide cells" in line 27 and replaced "SOFC/SOEC test rig" by "solid-oxide cell test rig". Thank you for noticing!
Best regards,
Dominik Schäfer
Reviewer 3 Report
Very detailed research applying a lot of devices and techniques, discussion is sound, conclusions justified. So paper can be accepted for publication. Some misprints can be corrected at proofsreading stage.
Author Response
Dear Reviewer,
thank you for your positive assessment of our publication draft.
We performed a final spellcheck and MDPI will provide final stylistic checks and spellcheck as well during the publication process.
Best regards,
Dominik Schäfer
