Next Article in Journal
Spectrum Modeling of Out-of-Band Intermodulation for Dual-Band RF Amplifiers in OFDM Modulation
Next Article in Special Issue
Closing the Wearable Gap-Part VII: A Retrospective of Stretch Sensor Tool Kit Development for Benchmark Testing
Previous Article in Journal
A Novel FastSLAM Framework Based on 2D Lidar for Autonomous Mobile Robot
Previous Article in Special Issue
Structural Health Monitoring System for Snow and Wind Load Measurement
 
 
Article

Article Versions Notes

Electronics 2020, 9(4), 696; https://doi.org/10.3390/electronics9040696
Action Date Notes Link
article xml file uploaded 24 April 2020 12:03 CEST Original file -
article xml uploaded. 24 April 2020 12:03 CEST Update https://www.mdpi.com/2079-9292/9/4/696/xml
article pdf uploaded. 24 April 2020 12:03 CEST Version of Record https://www.mdpi.com/2079-9292/9/4/696/pdf
article html file updated 24 April 2020 12:05 CEST Original file -
article html file updated 8 May 2020 17:11 CEST Update -
article html file updated 21 July 2022 02:52 CEST Update https://www.mdpi.com/2079-9292/9/4/696/html
Back to TopTop