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Open AccessArticle

Numerical Laplace Inversion Method for Through-Silicon Via (TSV) Noise Coupling in 3D-IC Design

1
Faculty of Science and Technology, Cadi Ayyad University, Marrakesh 40000, Morocco; [email protected] (H.B.); [email protected] (H.A.)
2
Electrical Engineering Department, Royal School of Aeronautics, Marrakesh 40000, Morocco
*
Author to whom correspondence should be addressed.
Electronics 2019, 8(9), 1010; https://doi.org/10.3390/electronics8091010
Received: 20 August 2019 / Revised: 28 August 2019 / Accepted: 29 August 2019 / Published: 10 September 2019
(This article belongs to the Special Issue Signal Processing and Analysis of Electrical Circuit)
Typical 3D integrated circuit structures based on through-silicon vias (TSVs) are complicated to study and analyze. Therefore, it seems important to find some methods to investigate them. In this paper, a method is proposed to model and compute the time-domain coupling noise in 3D Integrated Circuit (3D-IC) based on TSVs. It is based on the numerical inversion Laplace transform (NILT) method and the chain matrices. The method is validated using some experimental results and the Pspice and Matlab tools. The results confirm the effectiveness of the proposed technique and the noise is analyzed in several cases. It is found that TSV noise coupling is affected by different factors such as source characteristics, horizontal interconnections, and the type of Inputs and Outputs (I/O) drivers. View Full-Text
Keywords: 3D-IC design; NILT; TSV noise coupling; RDL; chain matrix; interconnect line 3D-IC design; NILT; TSV noise coupling; RDL; chain matrix; interconnect line
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Ait Belaid, K.; Belahrach, H.; Ayad, H. Numerical Laplace Inversion Method for Through-Silicon Via (TSV) Noise Coupling in 3D-IC Design. Electronics 2019, 8, 1010.

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