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Journal: Electronics, 2019
Volume: 8
Number: 1010

Article: Numerical Laplace Inversion Method for Through-Silicon Via (TSV) Noise Coupling in 3D-IC Design
Authors: by Khaoula Ait Belaid, Hassan Belahrach and Hassan Ayad
Link: https://www.mdpi.com/2079-9292/8/9/1010

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