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Journal: ElectronicsVolume: 8Number: 1010
Article: Numerical Laplace Inversion Method for Through-Silicon Via (TSV) Noise Coupling in 3D-IC Design
  • Authors:
  • Khaoula Ait Belaid1,*,
  • Hassan Belahrach1,2 and
  • Hassan Ayad1
Link: https://www.mdpi.com/2079-9292/8/9/1010

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