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Analytical Modeling of Metamaterial Differential Transmission Line Using Corrugated Ground Planes in High-Speed Printed Circuit Boards

Department of Electrical, Electronic, and Control Engineering, and the Institute for Information Technology Convergence, Hankyong National University, Anseong 17579, Korea
Electronics 2019, 8(3), 299; https://doi.org/10.3390/electronics8030299
Received: 11 January 2019 / Revised: 28 February 2019 / Accepted: 1 March 2019 / Published: 7 March 2019
(This article belongs to the Special Issue Engineering Metamaterials)
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Abstract

An analytical model for metamaterial differential transmission lines (MTM-DTLs) with a corrugated ground-plane electromagnetic bandgap (CGP-EBG) structure in high-speed printed circuit boards is proposed. The proposed model aims to efficiently and accurately predict the suppression of common-mode noise and differential signal transmission characteristics. Analytical expressions for the four-port impedance matrix of the CGP-EBG MTM-DTL are derived using coupled-line theory and a segmentation method. Converting the impedance matrix into mixed-mode scattering parameters enables obtaining common-mode noise suppression and differential signal transmission characteristics. The comprehensive evaluations of the CGP-EBG MTM-DTL using the proposed analytical model are also reported, which is validated by comparing mixed-mode scattering parameters Scc21 and Sdd21 with those obtained from full-wave simulations and measurements. The proposed analytical model provides a drastic reduction of computation time and accurate results compared to full-wave simulation. View Full-Text
Keywords: common-mode noise; corrugated ground plane; differential signaling; electromagnetic bandgap; metamaterial; stepped impedance common-mode noise; corrugated ground plane; differential signaling; electromagnetic bandgap; metamaterial; stepped impedance
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Kim, M. Analytical Modeling of Metamaterial Differential Transmission Line Using Corrugated Ground Planes in High-Speed Printed Circuit Boards. Electronics 2019, 8, 299.

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