Experimental Study on the Reliability of PBGA Electronic Packaging under Shock Loading

Round 1

Reviewer 1 Report

what is the resolution for strain guage?

can you resolve the damage of center and corner bumps with the resistance monitoring measurement?

please elaborate on the evidence that center bumps are more prone to failure than corner bumps. I am not able to find that. 

have you defined the points on Figure 7? where are those points?

which ones correspond to center bumps and which one to corner bumps?

pls clearly show the strain energy density for center and corner bumps in a table, for each loading condition. did the calculated strain energy map well with the observed failures?

did you define what does P-S-N curve stand for?

quality of English is bad. Sounds like a software translated from Chinese to English. 

Please rewrite many sentences that don't read well. 

Author Response

Pls see the Response to Reviewer 1 Comments.docx

Author Response File: Author Response.pdf

Reviewer 2 Report

Abstract part:

PBGA, one of the most important electronic packaging methods

replaced by

Plastic Ball Grid Array (PBGA) one of the most important electronic packaging methods  

PBGA assemblies are studied by optical microscope observation experiments

replaced by

PBGA assemblies are studied by optical microscope (OM).

Introduction:

Ball Grid Array Package (BGA) technology---

replaced by

Ball Grid Array (BGA) Package technology—

‘----microelectronics packaging under shock loading is foreign communications companies---‘

replaced by

‘----microelectronics packaging under thermal and mechanical shock loading is foreign communications companies---‘

Test Sample Design

When installing the PCB during the test, we should ensure good welding of signal line

replaced by

When installing the PCB during the test, it is important to ensure good welding of the signal line

Result part:

1.      Please insert the scale bar in Figure 7.

2.      Describe in details in results and discussion part why P2 case failure occurs in zigzag mode.

3.      Please insert the clear fracture image in Figure 14 and discussed the failure mode

Conclusion part:

Please rewrite the conclusion part according to your results

Author Response

Pls see Response to Reviewer 2 Comments.docx

Author Response File: Author Response.pdf

Round 2

Reviewer 1 Report

all comments are addressed well. 

Author Response

All the questions are revised in the paper in the red colour.

Author Response File: Author Response.pdf