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Journal: Electronics, 2019
Volume: 8
Number: 1127

Article: Development of a Hardware Simulator for Reliable Design of Modular Multilevel Converters Based on Junction-Temperature of IGBT Modules
Authors: by Seung-Rae Jo, Seok-Min Kim, Sungjoon Cho and Kyo-Beum Lee
Link: https://www.mdpi.com/2079-9292/8/10/1127

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