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Journal: Electronics, 2026
Volume: 15
Number: 29
Article:
A Scalable Ultra-Compact 1.2 kV/100 A SiC 3D Packaged Half-Bridge Building Block
Authors:
by
Junhong Tong, Wei-Jung Hsu, Qingyun Huang and Alex Q. Huang
Link:
https://www.mdpi.com/2079-9292/15/1/29
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