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Journal: Electronics, 2026
Volume: 15
Number: 112

Article: A3DSimVP: Enhancing SimVP-v2 with Audio and 3D Convolution
Authors: by Junfeng Yang, Mingrui Long, Hongjia Zhu, Limei Liu, Wenzhi Cao, Qin Li and Han Peng
Link: https://www.mdpi.com/2079-9292/15/1/112

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