Next Article in Journal
Development and Evaluation of a Piezoelectret Insole for Energy Harvesting Applications
Previous Article in Journal
Reconfigurable Intelligence Surface Assisted Multiuser Downlink Communication with User Scheduling
 
 

Order Article Reprints

Journal: Electronics, 2025
Volume: 14
Number: 4255

Article: Optimization Design of Spaceborne Microstrip Array by Strain Compensation Method Based on Multi-Physics Coupling Analysis
Authors: by Kaihang Fan, Kui Huang, Qi Xiao, Shuting Wang, Hao Liu and Huilin Wang
Link: https://www.mdpi.com/2079-9292/14/21/4255

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop