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Journal: Electronics, 2025
Volume: 14
Number: 4255
Article:
Optimization Design of Spaceborne Microstrip Array by Strain Compensation Method Based on Multi-Physics Coupling Analysis
Authors:
by
Kaihang Fan, Kui Huang, Qi Xiao, Shuting Wang, Hao Liu and Huilin Wang
Link:
https://www.mdpi.com/2079-9292/14/21/4255
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