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Journal: Electronics, 2025
Volume: 14
Number: 3549

Article: Spatial Monitoring of I/O Interconnection Nets in Flip-Chip Packages
Authors: by Emmanuel Bender, Moshe Sitbon, Tsuriel Avraham and Michael Gerasimov
Link: https://www.mdpi.com/2079-9292/14/17/3549

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