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Journal: Electronics, 2025
Volume: 14
Number: 3227

Article: Suppression of Cohesive Cracking Mode Based on Anisotropic Porosity in Sintered Silver Die Attach Encapsulated by Epoxy Molding Compounds
Authors: by Keisuke Wakamoto, Masaya Ukita, Ayumi Saito and Ken Nakahara
Link: https://www.mdpi.com/2079-9292/14/16/3227

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