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        Journal: Electronics, 2025
        Volume: 14 
                	Number: 3227 
                
        
        Article:
        Suppression of Cohesive Cracking Mode Based on Anisotropic Porosity in Sintered Silver Die Attach Encapsulated by Epoxy Molding Compounds 
        Authors: 
       	by
                    Keisuke Wakamoto, Masaya Ukita, Ayumi Saito and Ken Nakahara        
        Link:
        https://www.mdpi.com/2079-9292/14/16/3227
        
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