Enhancing Radiation Resilience and Throughput in Spaceborne RS(255,223) Encoder via Interleaved Pipelined Architecture
Abstract
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Li, X.; Zhou, L.; Zhu, Y. Enhancing Radiation Resilience and Throughput in Spaceborne RS(255,223) Encoder via Interleaved Pipelined Architecture. Electronics 2025, 14, 2447. https://doi.org/10.3390/electronics14122447
Li X, Zhou L, Zhu Y. Enhancing Radiation Resilience and Throughput in Spaceborne RS(255,223) Encoder via Interleaved Pipelined Architecture. Electronics. 2025; 14(12):2447. https://doi.org/10.3390/electronics14122447
Chicago/Turabian StyleLi, Xufeng, Li Zhou, and Yan Zhu. 2025. "Enhancing Radiation Resilience and Throughput in Spaceborne RS(255,223) Encoder via Interleaved Pipelined Architecture" Electronics 14, no. 12: 2447. https://doi.org/10.3390/electronics14122447
APA StyleLi, X., Zhou, L., & Zhu, Y. (2025). Enhancing Radiation Resilience and Throughput in Spaceborne RS(255,223) Encoder via Interleaved Pipelined Architecture. Electronics, 14(12), 2447. https://doi.org/10.3390/electronics14122447

