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Journal: Electronics, 2024
Volume: 13
Number: 4463
Article:
Design of High-Speed Thin-Film Lithium Niobate Modulator Utilizing Flip-Chip Bonding with Bump Contacts
Authors:
by
Yihui Yin, Jiayu Yang, Haiou Li, Wanli Yang, Yue Li and Hanyu Li
Link:
https://www.mdpi.com/2079-9292/13/22/4463
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